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Daniel J. McCarthy
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Eagan, MN, US
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last 30 patents
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Patent Grant
Method of fabricating a vertically mountable IC package
Patent number
7,494,920
Issue date
Feb 24, 2009
Honeywell International Inc.
Daniel McCarthy
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Method of fabricating a vertically mountable IC package
Publication number
20070090529
Publication date
Apr 26, 2007
Honeywell International Inc.
Daniel J. McCarthy
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...