Daniel J. Quinn

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Carrollton, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated-circuit leadframe adapted for a simultaneous bonding ope...
- Patent number 4,722,060
- Issue date Jan 26, 1988
- Thomson Components-Mostek Corporation
- Daniel J. Quinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming integrated circuits with contact pads in a stand...
- Patent number 4,685,998
- Issue date Aug 11, 1987
- Thomson Components-Mostek Corp.
- Daniel J. Quinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic assembly of integrated circuits
- Patent number 4,627,151
- Issue date Dec 9, 1986
- Thomson Components-Mostek Corporation
- Wayne A. Mulholland
- H01 - BASIC ELECTRIC ELEMENTS