Daniel J. Zierath

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Metal structures, devices, and methods
- Patent number 11,769,729
- Issue date Sep 26, 2023
- Intel Corporation
- Daniel J. Zierath
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit interconnects
- Patent number 11,018,054
- Issue date May 25, 2021
- Intel Corporation
- Daniel J. Zierath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barriers
- Patent number 10,651,082
- Issue date May 12, 2020
- Intel Corporation
- Daniel J. Zierath
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 9,514,983
- Issue date Dec 6, 2016
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless filled conductive structures
- Patent number 9,123,706
- Issue date Sep 1, 2015
- Intel Corporation
- Daniel J. Zierath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner layers for metal interconnects
- Patent number 8,779,589
- Issue date Jul 15, 2014
- Intel Corporation
- Harsono S. Simka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified electroplating solution components in a low-acid electroly...
- Patent number 7,371,311
- Issue date May 13, 2008
- Intel Corporation
- Daniel J Zierath
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus having plating solution container with current applying a...
- Patent number 7,279,084
- Issue date Oct 9, 2007
- Intel Corporation
- Radek P. Chalupa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METAL INTERCONNECTS, DEVICES, AND METHODS
- Publication number 20210167019
- Publication date Jun 3, 2021
- Intel Corporation
- Daniel Zierath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INTERCONNECTS
- Publication number 20200013673
- Publication date Jan 9, 2020
- Intel Corporation
- Daniel J. Zierath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL STRUCTURES, DEVICES, AND METHODS
- Publication number 20190393156
- Publication date Dec 26, 2019
- Intel Corporation
- Daniel J. Zierath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIERS
- Publication number 20190088538
- Publication date Mar 21, 2019
- Intel Corporation
- Daniel J. Zierath
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLESS FILLED CONDUCTIVE STRUCTURES
- Publication number 20150371949
- Publication date Dec 24, 2015
- Intel Corporation
- Daniel J. Zierath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20140183738
- Publication date Jul 3, 2014
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS FILLED CONDUCTIVE STRUCTURES
- Publication number 20130270703
- Publication date Oct 17, 2013
- Daniel J. Zierath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF FORMING METAL FLUORIDE BARRIERS FOR FLUORINATED LOW-K DIELECTRICS
- Publication number 20120258588
- Publication date Oct 11, 2012
- Christopher J. Jezewski
- B67 - OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS LIQUID...
Information Patent Application
BARRIERLESS SINGLE-PHASE INTERCONNECT
- Publication number 20120153483
- Publication date Jun 21, 2012
- Rohan N. Akolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER LAYERS FOR METAL INTERCONNECTS
- Publication number 20120153478
- Publication date Jun 21, 2012
- Harsono S. Simka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self Forming Metal Fluoride Barriers for Fluorinated Low-K Dielectrics
- Publication number 20100244252
- Publication date Sep 30, 2010
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating metal interconnects using a sacrificial layer...
- Publication number 20080113508
- Publication date May 15, 2008
- Rohan N. Akolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for reducing protrusions and within die thickness variation...
- Publication number 20060091018
- Publication date May 4, 2006
- Yang Cao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for improving electroplating in sub-0.1um interconnects by a...
- Publication number 20060006071
- Publication date Jan 12, 2006
- Guangli Che
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Modified electroplating solution components in a low-acid electroly...
- Publication number 20050274619
- Publication date Dec 15, 2005
- Daniel J. Zierath
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus having plating solution container with current applying a...
- Publication number 20050173241
- Publication date Aug 11, 2005
- Radek P. Chalupa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Modified electroplating solution components in a high-acid electrol...
- Publication number 20050077180
- Publication date Apr 14, 2005
- Daniel J. Zierath
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Modified electroplating solution components in a low-acid electroly...
- Publication number 20050077181
- Publication date Apr 14, 2005
- Daniel J. Zierath
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for improving electroplating in sub-0.1um interconnects by a...
- Publication number 20040245107
- Publication date Dec 9, 2004
- Guangli Che
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Methods for reducing protrusions and within die thickness variation...
- Publication number 20040188265
- Publication date Sep 30, 2004
- Yang Cao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Daniel J. Zierath

Person

Patents Grantslast 30 patents

Metal structures, devices, and methods

Integrated circuit interconnects

Diffusion barriers

Cobalt based interconnects and methods of fabrication thereof

Electroless filled conductive structures

Liner layers for metal interconnects

Modified electroplating solution components in a low-acid electroly...

Apparatus having plating solution container with current applying a...

Patents Applicationslast 30 patents

METAL INTERCONNECTS, DEVICES, AND METHODS

INTEGRATED CIRCUIT INTERCONNECTS

METAL STRUCTURES, DEVICES, AND METHODS

DIFFUSION BARRIERS

ELECTROLESS FILLED CONDUCTIVE STRUCTURES

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

ELECTROLESS FILLED CONDUCTIVE STRUCTURES

SELF FORMING METAL FLUORIDE BARRIERS FOR FLUORINATED LOW-K DIELECTRICS

BARRIERLESS SINGLE-PHASE INTERCONNECT

LINER LAYERS FOR METAL INTERCONNECTS

Self Forming Metal Fluoride Barriers for Fluorinated Low-K Dielectrics

Method of fabricating metal interconnects using a sacrificial layer...

Methods for reducing protrusions and within die thickness variation...

Method for improving electroplating in sub-0.1um interconnects by a...

Modified electroplating solution components in a low-acid electroly...

Apparatus having plating solution container with current applying a...

Modified electroplating solution components in a high-acid electrol...

Modified electroplating solution components in a low-acid electroly...

Method for improving electroplating in sub-0.1um interconnects by a...

Methods for reducing protrusions and within die thickness variation...