Daniel James Namishia

Person

Louisburg, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for pillar connection on frontside and passive device integ...
- Patent number 11,842,997
- Issue date Dec 12, 2023
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation stack for improved humidity performance and related f...
- Patent number 11,842,937
- Issue date Dec 12, 2023
- Wolfspeed, Inc.
- Chris Hardiman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for pillar connection on frontside and passive device integ...
- Patent number 11,769,768
- Issue date Sep 26, 2023
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic circuits having moisture protection encapsulati...
- Patent number 11,682,634
- Issue date Jun 20, 2023
- Wolfspeed, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor with enhanced reliability
- Patent number 11,658,234
- Issue date May 23, 2023
- Wolfspeed, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for pillar connection on frontside and passive device integ...
- Patent number 11,646,310
- Issue date May 9, 2023
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistors and power amplifiers including s...
- Patent number 11,616,136
- Issue date Mar 28, 2023
- Wolfspeed, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with improved ruggedness
- Patent number 11,587,842
- Issue date Feb 21, 2023
- Wolfspeed, Inc.
- Chris Hardiman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistors and power amplifiers including s...
- Patent number 10,971,612
- Issue date Apr 6, 2021
- Cree, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistors having improved contact spacing...
- Patent number 10,923,585
- Issue date Feb 16, 2021
- Cree, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with improved ruggedness
- Patent number 10,886,189
- Issue date Jan 5, 2021
- Cree, Inc.
- Chris Hardiman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with improved ruggedness
- Patent number 10,840,162
- Issue date Nov 17, 2020
- Cree, Inc.
- Chris Hardiman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic circuits having moisture protection encapsulati...
- Patent number 10,811,370
- Issue date Oct 20, 2020
- Cree, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with improved ruggedness
- Patent number 10,332,817
- Issue date Jun 25, 2019
- Cree, Inc.
- Chris Hardiman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating bond pad for power semiconductor devices
- Patent number 10,068,834
- Issue date Sep 4, 2018
- Cree, Inc.
- Sarah Kay Haney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress mitigation for thin and thick films used in semiconductor ci...
- Patent number 9,934,983
- Issue date Apr 3, 2018
- Cree, Inc.
- Zoltan Ring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation of advanced devices using novel PECVD and ALD schemes
- Patent number 9,812,338
- Issue date Nov 7, 2017
- Cree, Inc.
- Zoltan Ring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with bypassed gate structure field
- Patent number 9,786,660
- Issue date Oct 10, 2017
- Cree, Inc.
- Donald Farrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PECVD protective layers for semiconductor devices
- Patent number 9,761,439
- Issue date Sep 12, 2017
- Cree, Inc.
- Zoltan Ring
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Devices including ultra-short gates and methods of forming same
- Patent number 9,530,647
- Issue date Dec 27, 2016
- Cree, Inc.
- Zoltan Ring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using stress reduction barrier sub-layers in a semiconductor die
- Patent number 9,269,662
- Issue date Feb 23, 2016
- Cree, Inc.
- Zoltan Ring
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ohmic contact to semiconductor device
- Patent number 9,214,352
- Issue date Dec 15, 2015
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ni-rich Schottky contact
- Patent number 9,202,703
- Issue date Dec 1, 2015
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ohmic contact to semiconductor device
- Patent number 9,070,626
- Issue date Jun 30, 2015
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with crack stops
- Patent number 8,877,611
- Issue date Nov 4, 2014
- Cree, Inc.
- Van Allen Mieczkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming contact structures including alternating metal a...
- Patent number 8,563,372
- Issue date Oct 22, 2013
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with crack stops
- Patent number 8,357,996
- Issue date Jan 22, 2013
- Cree, Inc.
- Van Allen Mieczkowski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP-CHIP FIELD EFFECT TRANSISTOR LAYOUTS AND STRUCTURES
- Publication number 20240266348
- Publication date Aug 8, 2024
- Wolfspeed, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICES INCLUDING SELF-ALIGNED OHMIC CONTACTS AND CONTAC...
- Publication number 20240194751
- Publication date Jun 13, 2024
- Wolfspeed, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR INCLUDING FIELD PLATES
- Publication number 20240162304
- Publication date May 16, 2024
- MACOM Technology Solutions Holdings, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR DEVICE WITH INTEGRATED WIRE BONDING...
- Publication number 20240105763
- Publication date Mar 28, 2024
- Wolfspeed, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR AMPLIFIER WITH PCB ROUTING AND SURFACE MOUNTED TRANSISTO...
- Publication number 20240106397
- Publication date Mar 28, 2024
- Wolfspeed, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DIE INCLUDING MATCHING CIRCUIT
- Publication number 20240072732
- Publication date Feb 29, 2024
- Wolfspeed, Inc.
- Donald Farrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III NITRIDE-BASED MONOLITHIC MICROWAVE INTEGRATED CIRCUITS HA...
- Publication number 20230291367
- Publication date Sep 14, 2023
- Wolfspeed, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Limiting Failures Caused by Dendrite Growth on Semiconductor Chips
- Publication number 20230215833
- Publication date Jul 6, 2023
- Wolfspeed, Inc.
- Dan Namishia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IPD COMPONENTS HAVING SIC SUBSTRATES AND DEVICES AND PROCESSES IMPL...
- Publication number 20230197587
- Publication date Jun 22, 2023
- Wolfspeed, Inc.
- Donald FARRELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION STACK FOR IMPROVED HUMIDITY PERFORMANCE AND RELATED F...
- Publication number 20230031205
- Publication date Feb 2, 2023
- Cree, Inc.
- Chris Hardiman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT METAL OPENINGS THROUGH DIELECTRIC FILMS
- Publication number 20230029763
- Publication date Feb 2, 2023
- Cree, Inc.
- Christopher Hardiman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ENCAPSULATION FOR HUMIDITY ROBUSTNESS AND RELATED FABRIC...
- Publication number 20220384366
- Publication date Dec 1, 2022
- Cree, Inc.
- Kyoung-Keun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ENCAPSULATION FOR HUMIDITY ROBUSTNESS AND HIGHLY ACCELER...
- Publication number 20220384290
- Publication date Dec 1, 2022
- Wolfspeed, Inc.
- Kyoung-Keun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEG...
- Publication number 20220208758
- Publication date Jun 30, 2022
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR WITH ENHANCED RELIABILITY
- Publication number 20220130985
- Publication date Apr 28, 2022
- Cree, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEG...
- Publication number 20210375856
- Publication date Dec 2, 2021
- Cree, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Group III-Nitride High-Electron Mobility Transistors Configured wit...
- Publication number 20210359118
- Publication date Nov 18, 2021
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTORS AND POWER AMPLIFIERS INCLUDING S...
- Publication number 20210175351
- Publication date Jun 10, 2021
- Cree, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH IMPROVED RUGGEDNESS
- Publication number 20210043530
- Publication date Feb 11, 2021
- Cree, Inc.
- Chris Hardiman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC CIRCUITS HAVING MOISTURE PROTECTION ENCAPSULATI...
- Publication number 20210028127
- Publication date Jan 28, 2021
- Cree, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTORS AND POWER AMPLIFIERS INCLUDING S...
- Publication number 20200395475
- Publication date Dec 17, 2020
- Cree, Inc.
- Kyle Bothe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTORS HAVING IMPROVED CONTACT SPACING...
- Publication number 20200395474
- Publication date Dec 17, 2020
- Cree, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC CIRCUITS HAVING MOISTURE PROTECTION ENCAPSULATI...
- Publication number 20190326230
- Publication date Oct 24, 2019
- Cree, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH IMPROVED RUGGEDNESS
- Publication number 20190259682
- Publication date Aug 22, 2019
- Cree, Inc.
- Chris Hardiman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH IMPROVED RUGGEDNESS
- Publication number 20190172769
- Publication date Jun 6, 2019
- Cree, Inc.
- Chris Hardiman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor with Bypassed Gate Structure Field
- Publication number 20170271329
- Publication date Sep 21, 2017
- Cree, Inc.
- Donald Farrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PECVD PROTECTIVE LAYERS FOR SEMICONDUCTOR DEVICES
- Publication number 20160172315
- Publication date Jun 16, 2016
- Cree, Inc.
- Zoltan Ring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS MITIGATION FOR THIN AND THICK FILMS USED IN SEMICONDUCTOR CI...
- Publication number 20150221574
- Publication date Aug 6, 2015
- Cree, Inc.
- Zoltan Ring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES INCLUDING ULTRA-SHORT GATES AND METHODS OF FORMING SAME
- Publication number 20150084116
- Publication date Mar 26, 2015
- Cree, Inc.
- Zoltan Ring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION OF ADVANCED DEVICES USING NOVEL PECVD AND ALD SCHEMES
- Publication number 20140264960
- Publication date Sep 18, 2014
- Cree, Inc.
- Zoltan Ring
- H01 - BASIC ELECTRIC ELEMENTS

Daniel James Namishia

Person

Patents Grantslast 30 patents

Methods for pillar connection on frontside and passive device integ...

Encapsulation stack for improved humidity performance and related f...

Methods for pillar connection on frontside and passive device integ...

Packaged electronic circuits having moisture protection encapsulati...

Field effect transistor with enhanced reliability

Methods for pillar connection on frontside and passive device integ...

High electron mobility transistors and power amplifiers including s...

Semiconductor die with improved ruggedness

High electron mobility transistors and power amplifiers including s...

High electron mobility transistors having improved contact spacing...

Semiconductor die with improved ruggedness

Semiconductor die with improved ruggedness

Packaged electronic circuits having moisture protection encapsulati...

Semiconductor die with improved ruggedness

Floating bond pad for power semiconductor devices

Stress mitigation for thin and thick films used in semiconductor ci...

Encapsulation of advanced devices using novel PECVD and ALD schemes

Transistor with bypassed gate structure field

PECVD protective layers for semiconductor devices

Devices including ultra-short gates and methods of forming same

Using stress reduction barrier sub-layers in a semiconductor die

Ohmic contact to semiconductor device

Ni-rich Schottky contact

Ohmic contact to semiconductor device

Devices with crack stops

Methods of forming contact structures including alternating metal a...

Devices with crack stops

Patents Applicationslast 30 patents

FLIP-CHIP FIELD EFFECT TRANSISTOR LAYOUTS AND STRUCTURES

TRANSISTOR DEVICES INCLUDING SELF-ALIGNED OHMIC CONTACTS AND CONTAC...

FIELD EFFECT TRANSISTOR INCLUDING FIELD PLATES

METAL-INSULATOR-METAL CAPACITOR DEVICE WITH INTEGRATED WIRE BONDING...

TRANSISTOR AMPLIFIER WITH PCB ROUTING AND SURFACE MOUNTED TRANSISTO...

TRANSISTOR DIE INCLUDING MATCHING CIRCUIT

GROUP III NITRIDE-BASED MONOLITHIC MICROWAVE INTEGRATED CIRCUITS HA...

Limiting Failures Caused by Dendrite Growth on Semiconductor Chips

IPD COMPONENTS HAVING SIC SUBSTRATES AND DEVICES AND PROCESSES IMPL...

ENCAPSULATION STACK FOR IMPROVED HUMIDITY PERFORMANCE AND RELATED F...

INTERCONNECT METAL OPENINGS THROUGH DIELECTRIC FILMS

MULTILAYER ENCAPSULATION FOR HUMIDITY ROBUSTNESS AND RELATED FABRIC...

MULTILAYER ENCAPSULATION FOR HUMIDITY ROBUSTNESS AND HIGHLY ACCELER...

METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEG...

FIELD EFFECT TRANSISTOR WITH ENHANCED RELIABILITY

METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEG...

Group III-Nitride High-Electron Mobility Transistors Configured wit...

HIGH ELECTRON MOBILITY TRANSISTORS AND POWER AMPLIFIERS INCLUDING S...

SEMICONDUCTOR DIE WITH IMPROVED RUGGEDNESS

PACKAGED ELECTRONIC CIRCUITS HAVING MOISTURE PROTECTION ENCAPSULATI...

HIGH ELECTRON MOBILITY TRANSISTORS AND POWER AMPLIFIERS INCLUDING S...

HIGH ELECTRON MOBILITY TRANSISTORS HAVING IMPROVED CONTACT SPACING...

PACKAGED ELECTRONIC CIRCUITS HAVING MOISTURE PROTECTION ENCAPSULATI...

SEMICONDUCTOR DIE WITH IMPROVED RUGGEDNESS

SEMICONDUCTOR DIE WITH IMPROVED RUGGEDNESS

Transistor with Bypassed Gate Structure Field

PECVD PROTECTIVE LAYERS FOR SEMICONDUCTOR DEVICES

STRESS MITIGATION FOR THIN AND THICK FILMS USED IN SEMICONDUCTOR CI...

DEVICES INCLUDING ULTRA-SHORT GATES AND METHODS OF FORMING SAME

ENCAPSULATION OF ADVANCED DEVICES USING NOVEL PECVD AND ALD SCHEMES