Daniel K. Lau

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San Francisco, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and method for manufacturing same
- Patent number 7,563,648
- Issue date Jul 21, 2009
- Unisem (Mauritius) Holdings Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with included passive devices
- Patent number 7,489,021
- Issue date Feb 10, 2009
- Advanced Interconnect Technologies Limited
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal enhanced package for block mold assembly
- Patent number 7,259,445
- Issue date Aug 21, 2007
- Advanced Interconnect Technologies Limited
- Daniel K. Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin multiple semiconductor die package
- Patent number 7,247,933
- Issue date Jul 24, 2007
- Advanced Interconnect Technologies Limited
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Lead Frame with Included Passive Devices
- Publication number 20080036034
- Publication date Feb 14, 2008
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package and method for manufacturing same
- Publication number 20070161157
- Publication date Jul 12, 2007
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ENHANCED PACKAGE FOR BLOCK MOLD ASSEMBLY
- Publication number 20070065984
- Publication date Mar 22, 2007
- Daniel K. Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin multiple semiconductor die package
- Publication number 20060231937
- Publication date Oct 19, 2006
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS