Daniel Koehler

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Dresden, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for filling trench and relief geometries in semiconductor st...
- Patent number 7,265,025
- Issue date Sep 4, 2007
- Infineon Technologies AG
- Dietmar Temmler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch process for recessing polysilicon in trench structures
- Patent number 6,740,595
- Issue date May 25, 2004
- Infineon Technologies AG
- Stephan Kudelka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for filling trench and relief geometries in semiconductor st...
- Publication number 20050148171
- Publication date Jul 7, 2005
- Dietmar Temmler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etch process for recessing polysilicon in trench structures
- Publication number 20030194867
- Publication date Oct 16, 2003
- Infineon Technologies North America Corp.
- Stephan Kudelka
- H01 - BASIC ELECTRIC ELEMENTS