Daniel Lee Blass

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Owego, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Interconnect structure configured to control solder flow and method...
- Patent number 9,609,752
- Issue date Mar 28, 2017
- Lockheed Martin Corporation
- Daniel L. Blass
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MICROVIA PAD REPAIR
- Publication number 20150189759
- Publication date Jul 2, 2015
- Lockheed Martin Corporation
- Thomas Rovere
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR