Daniel Mark Dinneen

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Uniform flow behavior in an electroplating cell
- Patent number 10,711,364
- Issue date Jul 14, 2020
- Lam Research Corporation
- Daniel Mark Dinneen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatuses for electroplating and seed layer detection
- Patent number 10,669,644
- Issue date Jun 2, 2020
- Lam Research Corporation
- Daniel Mark Dinneen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatuses for electroplating and seed layer detection
- Patent number 10,407,794
- Issue date Sep 10, 2019
- Lam Research Corporation
- Daniel Mark Dinneen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatuses for electroplating and seed layer detection
- Patent number 10,196,753
- Issue date Feb 5, 2019
- Lam Research Corporation
- Daniel Mark Dinneen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for uniform flow behavior in an electroplating cell
- Patent number 9,945,044
- Issue date Apr 17, 2018
- Lam Research Corporation
- Daniel Mark Dinneen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatuses for electroplating and seed layer detection
- Patent number 9,822,460
- Issue date Nov 21, 2017
- Lam Research Corporation
- Daniel Mark Dinneen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating and post-electrofill systems with integrated process...
- Patent number 9,809,898
- Issue date Nov 7, 2017
- Lam Research Corporation
- Daniel Mark Dinneen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Small-volume electroless plating cell
- Patent number 7,690,324
- Issue date Apr 6, 2010
- Novellus Systems, Inc.
- Jingbin Feng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUSES FOR ELECTROPLATING AND SEED LAYER DETECTION
- Publication number 20190352792
- Publication date Nov 21, 2019
- LAM RESEARCH CORPORATION
- Daniel Mark Dinneen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR ELECTROPLATING AND SEED LAYER DETECTION
- Publication number 20190127873
- Publication date May 2, 2019
- LAM RESEARCH CORPORATION
- Daniel Mark Dinneen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
UNIFORM FLOW BEHAVIOR IN AN ELECTROPLATING CELL
- Publication number 20180202062
- Publication date Jul 19, 2018
- LAM RESEARCH CORPORATION
- Daniel Mark Dinneen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS AND APPARATUSES FOR ELECTROPLATING AND SEED LAYER DETECTION
- Publication number 20180038009
- Publication date Feb 8, 2018
- LAM RESEARCH CORPORATION
- Daniel Mark Dinneen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Methods and Apparatuses for Electroplating and Seed Layer Detection
- Publication number 20150206770
- Publication date Jul 23, 2015
- LAM RESEARCH CORPORATION
- Daniel Mark Dinneen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR UNIFORM FLOW BEHAVIOR IN AN ELECTROPLATING CELL
- Publication number 20150122638
- Publication date May 7, 2015
- LAM RESEARCH CORPORATION
- Daniel Mark Dinneen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING AND POST-ELECTROFILL SYSTEMS WITH INTEGRATED PROCESS...
- Publication number 20150001087
- Publication date Jan 1, 2015
- Novellus Systems, Inc.
- Daniel Mark Dinneen
- H01 - BASIC ELECTRIC ELEMENTS

Daniel Mark Dinneen

Person

Patents Grantslast 30 patents

Uniform flow behavior in an electroplating cell

Methods and apparatuses for electroplating and seed layer detection

Methods and apparatuses for electroplating and seed layer detection

Methods and apparatuses for electroplating and seed layer detection

Method for uniform flow behavior in an electroplating cell

Methods and apparatuses for electroplating and seed layer detection

Electroplating and post-electrofill systems with integrated process...

Small-volume electroless plating cell

Patents Applicationslast 30 patents

METHODS AND APPARATUSES FOR ELECTROPLATING AND SEED LAYER DETECTION

METHODS AND APPARATUSES FOR ELECTROPLATING AND SEED LAYER DETECTION

UNIFORM FLOW BEHAVIOR IN AN ELECTROPLATING CELL

METHODS AND APPARATUSES FOR ELECTROPLATING AND SEED LAYER DETECTION

Methods and Apparatuses for Electroplating and Seed Layer Detection

METHOD FOR UNIFORM FLOW BEHAVIOR IN AN ELECTROPLATING CELL

ELECTROPLATING AND POST-ELECTROFILL SYSTEMS WITH INTEGRATED PROCESS...