Daniel Maurer

Person

Feld am See, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Method for processing a layer structure and microelectromechanical...
- Patent number 11,787,686
- Issue date Oct 17, 2023
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having alignment pads and method of manufactur...
- Patent number 11,616,032
- Issue date Mar 28, 2023
- Infineon Technologies AG
- Daniel Maurer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a layer structure and microelectromechanical...
- Patent number 11,180,362
- Issue date Nov 23, 2021
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for processing a layer structure and microelectromechanical...
- Patent number 10,766,766
- Issue date Sep 8, 2020
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical structure and method for manufacturing the same
- Patent number 10,710,874
- Issue date Jul 14, 2020
- Infineon Technologies AG
- Tobias Frischmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical structure comprising carbon material and method for...
- Patent number 10,106,398
- Issue date Oct 23, 2018
- Infineon Technologies AG
- Ulrich Schmid
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical structure and method for fabricating the same
- Patent number 10,081,533
- Issue date Sep 25, 2018
- Infineon Technologies AG
- Ulrich Schmid
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Processing a sacrificial material during manufacture of a microfabr...
- Patent number 9,511,560
- Issue date Dec 6, 2016
- Infineon Technologies AG
- Guenter Denifl
- B44 - DECORATIVE ARTS
Information Patent Grant
Method for manufacturing a plurality of microphone structures, micr...
- Patent number 9,439,017
- Issue date Sep 6, 2016
- Infineon Technologies AG
- Ursula Hedenig
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Micro mechanical structure and method for fabricating the same
- Patent number 9,212,045
- Issue date Dec 15, 2015
- Infineon Technologies AG
- Ulrich Schmid
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for processing a wafer at unmasked areas and previously mask...
- Patent number 8,871,550
- Issue date Oct 28, 2014
- Infineon Technologies AG
- Thomas Grille
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240162296
- Publication date May 16, 2024
- Infineon Technologies Austria AG
- Daniel Maurer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD FOR FABRICATING A SEMICONDUCTOR WAFER
- Publication number 20230282596
- Publication date Sep 7, 2023
- Infineon Technologies Austria AG
- Andreas Kleinbichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Processing a Layer Structure and Microelectromechanical...
- Publication number 20210363002
- Publication date Nov 25, 2021
- INFINEON TECHNOLOGIES AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ALIGNMENT PADS AND METHOD OF MANUFACTUR...
- Publication number 20210242148
- Publication date Aug 5, 2021
- INFINEON TECHNOLOGIES AG
- Daniel Maurer
- G01 - MEASURING TESTING
Information Patent Application
Method for Processing a Layer Structure and Microelectromechanical...
- Publication number 20200277183
- Publication date Sep 3, 2020
- INFINEON TECHNOLOGIES AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PROCESSING A LAYER STRUCTURE AND MICROELECTROMECHANICAL...
- Publication number 20190071303
- Publication date Mar 7, 2019
- INFINEON TECHNOLOGIES AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180002167
- Publication date Jan 4, 2018
- INFINEON TECHNOLOGIES AG
- Tobias Frischmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micromechanical Structure and Method for Fabricating the Same
- Publication number 20160353210
- Publication date Dec 1, 2016
- INFINEON TECHNOLOGIES AG
- Ulrich Schmid
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micromechanical Structure and Method for Fabricating the Same
- Publication number 20160031701
- Publication date Feb 4, 2016
- INFINEON TECHNOLOGIES AG
- Ulrich Schmid
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A PLURALITY OF MICROPHONE STRUCTURES, MICR...
- Publication number 20150230039
- Publication date Aug 13, 2015
- INFINEON TECHNOLOGIES AG
- Ursula Hedenig
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Carbon Layers for High Temperature Processes
- Publication number 20140335700
- Publication date Nov 13, 2014
- Guenter Denifl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for Processing a Wafer at Unmasked Areas and Previously Mask...
- Publication number 20130313661
- Publication date Nov 28, 2013
- INFINEON TECHNOLOGIES AG
- Thomas Grille
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESSING A SACRIFICIAL MATERIAL DURING MANUFACTURE OF A MICROFABR...
- Publication number 20130273326
- Publication date Oct 17, 2013
- INFINEON TECHNOLOGIES AG
- Guenther Denifl
- B44 - DECORATIVE ARTS

Daniel Maurer

Person

Patents Grantslast 30 patents

Method for processing a layer structure and microelectromechanical...

Semiconductor device having alignment pads and method of manufactur...

Method for processing a layer structure and microelectromechanical...

Method for processing a layer structure and microelectromechanical...

Micromechanical structure and method for manufacturing the same

Micromechanical structure comprising carbon material and method for...

Micromechanical structure and method for fabricating the same

Processing a sacrificial material during manufacture of a microfabr...

Method for manufacturing a plurality of microphone structures, micr...

Micro mechanical structure and method for fabricating the same

Method for processing a wafer at unmasked areas and previously mask...

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR WAFER AND METHOD FOR FABRICATING A SEMICONDUCTOR WAFER

Method for Processing a Layer Structure and Microelectromechanical...

SEMICONDUCTOR DEVICE HAVING ALIGNMENT PADS AND METHOD OF MANUFACTUR...

Method for Processing a Layer Structure and Microelectromechanical...

METHOD FOR PROCESSING A LAYER STRUCTURE AND MICROELECTROMECHANICAL...

MICROMECHANICAL STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Micromechanical Structure and Method for Fabricating the Same

Micromechanical Structure and Method for Fabricating the Same

METHOD FOR MANUFACTURING A PLURALITY OF MICROPHONE STRUCTURES, MICR...

Carbon Layers for High Temperature Processes

Method for Processing a Wafer at Unmasked Areas and Previously Mask...

PROCESSING A SACRIFICIAL MATERIAL DURING MANUFACTURE OF A MICROFABR...