Daniel N. Sobieski

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Control of warpage using ABF GC cavity for embedded die package
- Patent number 12,009,318
- Issue date Jun 11, 2024
- Intel Corporation
- Digvijay A. Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of warpage using ABF GC cavity for embedded die package
- Patent number 11,322,457
- Issue date May 3, 2022
- Intel Corporation
- Digvijay A. Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inorganic interposer for multi-chip packaging
- Patent number 10,692,847
- Issue date Jun 23, 2020
- Intel Corporation
- Daniel Sobieski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of warpage using ABF GC cavity for embedded die package
- Patent number 10,658,307
- Issue date May 19, 2020
- Intel Corporation
- Digvijay A. Rorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a microelectronic substrate
- Patent number 10,494,700
- Issue date Dec 3, 2019
- Intel Corporation
- Robert A. May
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of forming an interference shield on a substrate
- Patent number 10,375,832
- Issue date Aug 6, 2019
- Intel Corporation
- Digvijay A. Raorane
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flexible microelectronic systems and methods of fabricating the same
- Patent number 10,103,037
- Issue date Oct 16, 2018
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of dielectric with smooth surface
- Patent number 10,070,537
- Issue date Sep 4, 2018
- Intel Corporation
- Deepak Arora
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Control of warpage using ABF GC cavity for embedded die package
- Patent number 9,941,219
- Issue date Apr 10, 2018
- Intel Corporation
- Digvijay A. Rorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of embedded thin film capacitors in package substrates
- Patent number 9,941,054
- Issue date Apr 10, 2018
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid pitch package with ultra high density interconnect capability
- Patent number 9,899,311
- Issue date Feb 20, 2018
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic substrates having copper alloy conductive route str...
- Patent number 9,758,845
- Issue date Sep 12, 2017
- Intel Corporation
- Robert A. May
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Hybrid pitch package with ultra high density interconnect capability
- Patent number 9,633,938
- Issue date Apr 25, 2017
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumpless build-up layer (BBUL) semiconductor package with ultra-thi...
- Patent number 9,520,350
- Issue date Dec 13, 2016
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device, system and method for providing MEMS structures of a semico...
- Patent number 9,505,610
- Issue date Nov 29, 2016
- Intel Corporation
- Weng Hong Teh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integration of embedded thin film capacitors in package substrates
- Patent number 9,420,693
- Issue date Aug 16, 2016
- Intel Corporation
- Robert L. Sankman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film based electromagnetic interference shielding with BBUL/co...
- Patent number 9,232,686
- Issue date Jan 5, 2016
- Intel Corporation
- Digvijay A. Raorane
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
CONTROL OF WARPAGE USING ABF GC CAVITY FOR EMBEDDED DIE PACKAGE
- Publication number 20220230972
- Publication date Jul 21, 2022
- Intel Corporation
- Digvijay A. RAORANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF WARPAGE USING ABF GC CAVITY FOR EMBEDDED DIE PACKAGE
- Publication number 20200251426
- Publication date Aug 6, 2020
- Intel Corporation
- Digvijay A. RAORANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF WARPAGE USING ABF GC CAVITY FOR EMBEDDED DIE PACKAGE
- Publication number 20180301423
- Publication date Oct 18, 2018
- Intel Corporation
- DIGVIJAY A. RORANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INORGANIC INTERPOSER FOR MULTI-CHIP PACKAGING
- Publication number 20180240788
- Publication date Aug 23, 2018
- Intel Corporation
- Daniel Sobieski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC SUBSTRATES HAVING COPPER ALLOY CONDUCTIVE ROUTE STR...
- Publication number 20170362684
- Publication date Dec 21, 2017
- Intel Corporation
- Robert A May
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FORMING AN ELECTRICAL PACKAGE
- Publication number 20170318669
- Publication date Nov 2, 2017
- Intel Corporation
- Kristof Darmawikarta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID PITCH PACKAGE WITH ULTRA HIGH DENSITY INTERCONNECT CAPABILITY
- Publication number 20170092575
- Publication date Mar 30, 2017
- Intel Corporation
- Mathew J. MANUSHAROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID PITCH PACKAGE WITH ULTRA HIGH DENSITY INTERCONNECT CAPABILITY
- Publication number 20170092573
- Publication date Mar 30, 2017
- Intel Corporation
- Mathew J. MANUSHAROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FORMING AN ELECTRICAL PACKAGE
- Publication number 20170064821
- Publication date Mar 2, 2017
- Kristof Darmawikarta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATION OF EMBEDDED THIN FILM CAPACITORS IN PACKAGE SUBSTRATES
- Publication number 20160329153
- Publication date Nov 10, 2016
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF DIELECTRIC WITH SMOOTH SURFACE
- Publication number 20160192508
- Publication date Jun 30, 2016
- Intel Corporation
- Deepak Arora
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICROELECTRONIC SUBSTRATES HAVING COPPER ALLOY CONDUCTIVE ROUTE STR...
- Publication number 20160183361
- Publication date Jun 23, 2016
- Intel Corporation
- Robert A May
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
THIN FILM BASED ELECTROMAGNETIC INTERFERENCE SHIELDING WITH BBUL/CO...
- Publication number 20160088738
- Publication date Mar 24, 2016
- Intel Corporation
- Digvijay A. RAORANE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL OF WARPAGE USING ABF GC CAVITY FOR EMBEDDED DIE PACKAGE
- Publication number 20160086894
- Publication date Mar 24, 2016
- Intel Corporation
- DIGVIJAY A. RORANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF EMBEDDED THIN FILM CAPACITORS IN PACKAGE SUBSTRATES
- Publication number 20160088736
- Publication date Mar 24, 2016
- Robert L. SANKMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE MICROELECTRONIC SYSTEMS AND METHODS OF FABRICATING THE SAME
- Publication number 20150325491
- Publication date Nov 12, 2015
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM BASED ELECTROMAGNETIC INTERFERENCE SHIELDING WITH BBUL/CO...
- Publication number 20150282395
- Publication date Oct 1, 2015
- Digvijay A. RAORANE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE, SYSTEM AND METHOD FOR PROVIDING MEMS STRUCTURES OF A SEMICO...
- Publication number 20150084139
- Publication date Mar 26, 2015
- Weng Hong Teh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FORMATION OF DIELECTRIC WITH SMOOTH SURFACE
- Publication number 20140353019
- Publication date Dec 4, 2014
- Deepak Arora
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BUMPLESS BUILD-UP LAYER (BBUL) SEMICONDUCTOR PACKAGE WITH ULTRA-THI...
- Publication number 20140264830
- Publication date Sep 18, 2014
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS

Daniel N. Sobieski

Person

Patents Grantslast 30 patents

Control of warpage using ABF GC cavity for embedded die package

Control of warpage using ABF GC cavity for embedded die package

Inorganic interposer for multi-chip packaging

Control of warpage using ABF GC cavity for embedded die package

Method of fabricating a microelectronic substrate

Method of forming an interference shield on a substrate

Flexible microelectronic systems and methods of fabricating the same

Formation of dielectric with smooth surface

Control of warpage using ABF GC cavity for embedded die package

Integration of embedded thin film capacitors in package substrates

Hybrid pitch package with ultra high density interconnect capability

Microelectronic substrates having copper alloy conductive route str...

Hybrid pitch package with ultra high density interconnect capability

Bumpless build-up layer (BBUL) semiconductor package with ultra-thi...

Device, system and method for providing MEMS structures of a semico...

Integration of embedded thin film capacitors in package substrates

Thin film based electromagnetic interference shielding with BBUL/co...

Patents Applicationslast 30 patents

CONTROL OF WARPAGE USING ABF GC CAVITY FOR EMBEDDED DIE PACKAGE

CONTROL OF WARPAGE USING ABF GC CAVITY FOR EMBEDDED DIE PACKAGE

CONTROL OF WARPAGE USING ABF GC CAVITY FOR EMBEDDED DIE PACKAGE

INORGANIC INTERPOSER FOR MULTI-CHIP PACKAGING

MICROELECTRONIC SUBSTRATES HAVING COPPER ALLOY CONDUCTIVE ROUTE STR...

ELECTRONIC PACKAGE AND METHOD FORMING AN ELECTRICAL PACKAGE

HYBRID PITCH PACKAGE WITH ULTRA HIGH DENSITY INTERCONNECT CAPABILITY

HYBRID PITCH PACKAGE WITH ULTRA HIGH DENSITY INTERCONNECT CAPABILITY

ELECTRONIC PACKAGE AND METHOD FORMING AN ELECTRICAL PACKAGE

INTEGRATION OF EMBEDDED THIN FILM CAPACITORS IN PACKAGE SUBSTRATES

FORMATION OF DIELECTRIC WITH SMOOTH SURFACE

MICROELECTRONIC SUBSTRATES HAVING COPPER ALLOY CONDUCTIVE ROUTE STR...

THIN FILM BASED ELECTROMAGNETIC INTERFERENCE SHIELDING WITH BBUL/CO...

CONTROL OF WARPAGE USING ABF GC CAVITY FOR EMBEDDED DIE PACKAGE

INTEGRATION OF EMBEDDED THIN FILM CAPACITORS IN PACKAGE SUBSTRATES

FLEXIBLE MICROELECTRONIC SYSTEMS AND METHODS OF FABRICATING THE SAME

THIN FILM BASED ELECTROMAGNETIC INTERFERENCE SHIELDING WITH BBUL/CO...

DEVICE, SYSTEM AND METHOD FOR PROVIDING MEMS STRUCTURES OF A SEMICO...

FORMATION OF DIELECTRIC WITH SMOOTH SURFACE

BUMPLESS BUILD-UP LAYER (BBUL) SEMICONDUCTOR PACKAGE WITH ULTRA-THI...