Daniel Obermeier

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Ensdorf, DE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 11,410,906
- Issue date Aug 9, 2022
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR MODULE HAVING A METALLIC CLIP WITH ULTRASONICAL...
- Publication number 20240404982
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Marian Sebastian Broll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Fabricating a Semiconductor Pa...
- Publication number 20200395266
- Publication date Dec 17, 2020
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS