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DANIEL PANTUSO
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Portland, OR, US
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Patents Grants
last 30 patents
Information
Patent Grant
Fabrication and use of through silicon vias on double sided interco...
Patent number
11,594,524
Issue date
Feb 28, 2023
Intel Corporation
Brennen K. Mueller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication and use of through silicon vias on double sided interco...
Patent number
11,251,156
Issue date
Feb 15, 2022
Intel Corporation
Brennen K. Mueller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reducing in-plane distortion from wafer to wafer bonding using a du...
Patent number
11,195,719
Issue date
Dec 7, 2021
Intel Corporation
Chytra Pawashe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor fin design to mitigate fin collapse
Patent number
11,171,057
Issue date
Nov 9, 2021
Intel Corporation
Glenn A. Glass
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fluid viscosity control during wafer bonding
Patent number
11,056,356
Issue date
Jul 6, 2021
Intel Corporation
Brennen K. Mueller
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Integrated thermoelectric cooling
Patent number
10,825,752
Issue date
Nov 3, 2020
Intel Corporation
Lei Jiang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer to wafer bonding with low wafer distortion
Patent number
10,720,345
Issue date
Jul 21, 2020
Intel Corporation
Mauro J. Kobrinsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Compliant layer for wafer to wafer bonding
Patent number
10,707,186
Issue date
Jul 7, 2020
Intel Corporation
Mauro J. Kobrinsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for enhancing fracture resistance of interconnects
Patent number
9,691,716
Issue date
Jun 27, 2017
Intel Corporation
Christopher J. Jezewski
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for enhancing fracture resistance of interconnects
Patent number
9,343,411
Issue date
May 17, 2016
Intel Corporation
Christopher J. Jezewski
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally coupling electrically decoupling cooling device for integ...
Patent number
6,646,340
Issue date
Nov 11, 2003
Intel Corporation
Timothy L. Deeter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally coupling electrically decoupling cooling device for integ...
Patent number
6,525,419
Issue date
Feb 25, 2003
Intel Corporation
Timothy L. Deeter
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
THERMAL MANAGEMENT STRUCTURES IN SEMICONDUCTOR DEVICES AND METHODS...
Publication number
20220415807
Publication date
Dec 29, 2022
Intel Corporation
Chytra Pawashe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION AND USE OF THROUGH SILICON VIAS ON DOUBLE SIDED INTERCO...
Publication number
20220130803
Publication date
Apr 28, 2022
Intel Corporation
Brennen K. MUELLER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR FIN DESIGN TO MITIGATE FIN COLLAPSE
Publication number
20200066595
Publication date
Feb 27, 2020
Intel Corporation
GLENN A. GLASS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REDUCING IN-PLANE DISTORTION FROM WAFER TO WAFER BONDING USING A DU...
Publication number
20190304784
Publication date
Oct 3, 2019
Intel Corporation
Chytra PAWASHE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION AND USE OF THROUGH SILICON VIAS ON DOUBLE SIDED INTERCO...
Publication number
20180323174
Publication date
Nov 8, 2018
Intel Corporation
Brennen K. MUELLER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES FOR ENHANCING FRACTURE RESISTANCE OF INTERCONNECTS
Publication number
20160268218
Publication date
Sep 15, 2016
Intel Corporation
CHRISTOPHER J. JEZEWSKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED THERMOELECTRIC COOLING
Publication number
20160027717
Publication date
Jan 28, 2016
Lei Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES FOR ENHANCING FRACTURE RESISTANCE OF INTERCONNECTS
Publication number
20140210098
Publication date
Jul 31, 2014
Christopher J. Jezewski
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY COUPLING ELECTRICALLY DECOUPLING COOLING DEVICE FOR INTEG...
Publication number
20030151131
Publication date
Aug 14, 2003
Timothy L. Deeter
H01 - BASIC ELECTRIC ELEMENTS