Daniel Parker

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Palo Alto, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for dicing released MEMS wafers
- Patent number 6,830,990
- Issue date Dec 14, 2004
- LightConnect, Inc.
- Kenneth Honer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress isolating die attach structure and method
- Patent number 6,822,318
- Issue date Nov 23, 2004
- LightConnect, Inc.
- Kenneth A. Honer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stress isolating die attach structure and method
- Publication number 20020185715
- Publication date Dec 12, 2002
- Kenneth A. Honer
- H01 - BASIC ELECTRIC ELEMENTS