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Daniel Porwol
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Straubing, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Electronic component with semiconductor die having a low ohmic port...
Patent number
11,605,572
Issue date
Mar 14, 2023
Infineon Technologies AG
Daniel Porwol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Infrared emitter arrangement and method for producing an infrared e...
Patent number
10,694,584
Issue date
Jun 23, 2020
Infineon Technologies AG
Stephan Pindl
G02 - OPTICS
Information
Patent Grant
Method for handling a product substrate and a bonded substrate system
Patent number
10,600,690
Issue date
Mar 24, 2020
Infineon Technologies AG
Georg Meyer-Berg
B32 - LAYERED PRODUCTS
Information
Patent Grant
Method for fabricating a semiconductor chip panel
Patent number
10,483,133
Issue date
Nov 19, 2019
Infineon Technologies AG
Daniel Porwol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded system and a method for adhesively bonding a hygroscopic mat...
Patent number
10,332,814
Issue date
Jun 25, 2019
Infineon Technologies AG
Claus Von Waechter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for handling a product substrate, a bonded substrate system...
Patent number
10,056,295
Issue date
Aug 21, 2018
Infineon Technologies AG
Georg Meyer-Berg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Temporary mechanical stabilization of semiconductor cavities
Patent number
9,988,262
Issue date
Jun 5, 2018
Infineon Technologies AG
Dominic Maier
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Chip package and a method of producing the same
Patent number
9,981,843
Issue date
May 29, 2018
Infineon Technologies AG
Dominic Maier
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method for fabricating a semiconductor chip panel
Patent number
9,953,846
Issue date
Apr 24, 2018
Infineon Technologies AG
Daniel Porwol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating a semiconductor chip panel
Patent number
9,455,160
Issue date
Sep 27, 2016
Infineon Technologies AG
Daniel Porwol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating a semiconductor device
Patent number
8,906,749
Issue date
Dec 9, 2014
Infineon Technologies AG
Michael Bauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mold method
Patent number
8,394,308
Issue date
Mar 12, 2013
Infineon Technologies AG
Markus Brunnbauer
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Electronic device and method of manufacturing same
Patent number
8,173,488
Issue date
May 8, 2012
Intel Mobile Communications GmbH
Michael Bauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mold apparatus and method
Patent number
8,158,046
Issue date
Apr 17, 2012
Infineon Technologies AG
Markus Brunnbauer
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Reconfigured wafer alignment
Patent number
7,943,423
Issue date
May 17, 2011
Infineon Technologies AG
Jens Pohl
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Package Having an Electronic Component and an Encapsulant Encapsula...
Publication number
20230187298
Publication date
Jun 15, 2023
INFINEON TECHNOLOGIES AG
Daniel Porwol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Component with Semiconductor Die Having a Low Ohmic Port...
Publication number
20210335687
Publication date
Oct 28, 2021
INFINEON TECHNOLOGIES AG
Daniel Porwol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND METHOD FOR DEBONDING A STRUCTURE FROM A MAIN SURFACE REG...
Publication number
20200023630
Publication date
Jan 23, 2020
INFINEON TECHNOLOGIES AG
Alfred Sigl
B32 - LAYERED PRODUCTS
Information
Patent Application
Method for Handling a Product Substrate and a Bonded Substrate System
Publication number
20180350683
Publication date
Dec 6, 2018
INFINEON TECHNOLOGIES AG
Georg Meyer-Berg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Fabricating a Semiconductor Chip Panel
Publication number
20180226276
Publication date
Aug 9, 2018
INFINEON TECHNOLOGIES AG
Daniel Porwol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INFRARED EMITTER ARRANGEMENT AND METHOD FOR PRODUCING AN INFRARED E...
Publication number
20180146512
Publication date
May 24, 2018
INFINEON TECHNOLOGIES AG
Stephan Pindl
G02 - OPTICS
Information
Patent Application
TEMPORARY MECHANICAL STABILIZATION OF SEMICONDUCTOR CAVITIES
Publication number
20180086632
Publication date
Mar 29, 2018
INFINEON TECHNOLOGIES AG
Dominic Maier
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Method for Fabricating a Semiconductor Chip Panel
Publication number
20160379847
Publication date
Dec 29, 2016
INFINEON TECHNOLOGIES AG
Daniel Porwol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip Package and a Method of Producing the Same
Publication number
20160311679
Publication date
Oct 27, 2016
INFINEON TECHNOLOGIES AG
Dominic Maier
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
BONDED SYSTEM AND A METHOD FOR ADHESIVELY BONDING A HYGROSCOPIC MAT...
Publication number
20160247739
Publication date
Aug 25, 2016
INFINEON TECHNOLOGIES AG
Claus Von Waechter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Handling a Product Substrate, a Bonded Substrate System...
Publication number
20160218039
Publication date
Jul 28, 2016
INFINEON TECHNOLOGIES AG
Georg Meyer-Berg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package and Method of Fabrication Thereof
Publication number
20160155680
Publication date
Jun 2, 2016
INFINEON TECHNOLOGIES AG
Andreas Stueckjuergen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Fabricating a Semiconductor Chip Panel
Publication number
20140197551
Publication date
Jul 17, 2014
INFINEON TECHNOLOGIES AG
Daniel Porwol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Fabricating a Semiconductor Device
Publication number
20130256922
Publication date
Oct 3, 2013
INFINEON TECHNOLOGIES AG
Michael Bauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLD APPARATUS AND METHOD
Publication number
20120202319
Publication date
Aug 9, 2012
INFINEON TECHNOLOGIES AG
Markus Brunnbauer
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
RECONFIGURED WAFER ALIGNMENT
Publication number
20100233831
Publication date
Sep 16, 2010
INFINEON TECHNOLOGIES AG
Jens Pohl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Device and Method of Manufacturing Same
Publication number
20100078822
Publication date
Apr 1, 2010
Michael BAUER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLD APPARATUS AND METHOD
Publication number
20070235897
Publication date
Oct 11, 2007
Infineon Technologies AG
Markus Brunnbauer
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL