Daniel Richter

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Radebeul, DE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor dies with reduced area consumption
- Patent number 9,478,489
- Issue date Oct 25, 2016
- GLOBALFOUNDRIES Inc.
- Daniel Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate dicing technique for separating semiconductor dies with r...
- Patent number 8,664,025
- Issue date Mar 4, 2014
- GLOBALFOUNDRIES Inc.
- Daniel Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient method of forming and assembling a microelectronic chip i...
- Patent number 7,491,556
- Issue date Feb 17, 2009
- Advanced Micro Devices, Inc.
- Gotthard Jungnickel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIES WITH REDUCED AREA CONSUMPTION
- Publication number 20140110854
- Publication date Apr 24, 2014
- GLOBALFOUNDRIES INC.
- Daniel Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Dicing Technique for Separating Semiconductor Dies with R...
- Publication number 20120049379
- Publication date Mar 1, 2012
- GLOBALFOUNDRIES INC.
- Daniel Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Efficient method of forming and assembling a microelectronic chip i...
- Publication number 20060172444
- Publication date Aug 3, 2006
- Gotthard Jungnickel
- H01 - BASIC ELECTRIC ELEMENTS