Daniel Richter

Person

Goldsboro, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device with top side pin array and manufacturing method...
- Patent number 12,205,827
- Issue date Jan 21, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with top side pin array and manufacturing method...
- Patent number 10,832,921
- Issue date Nov 10, 2020
- Amkor Technology, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 10,734,343
- Issue date Aug 4, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with top side pin array and manufacturing method...
- Patent number 10,304,697
- Issue date May 28, 2019
- Amkor Technology, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Die-Attach Fillet Height Reduction
- Publication number 20240421044
- Publication date Dec 19, 2024
- Wolfspeed, Inc.
- Daniel Ginn Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20240421029
- Publication date Dec 19, 2024
- Wolfspeed, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Enhanced Power Semiconductor Package
- Publication number 20240243106
- Publication date Jul 18, 2024
- Wolfspeed, Inc.
- Daniel Ginn Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES HAVING MOISTURE BARRIERS
- Publication number 20230378010
- Publication date Nov 23, 2023
- Wolfspeed, Inc.
- Dev Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BACKSIDE METALLIZATION METHODS AND APPARATUS
- Publication number 20230326897
- Publication date Oct 12, 2023
- Wolfspeed, Inc.
- Daniel Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
- Publication number 20210043465
- Publication date Feb 11, 2021
- Amkor Technology Singapore Holding Pte. Ltd
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20200357763
- Publication date Nov 12, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
- Publication number 20190279882
- Publication date Sep 12, 2019
- Amkor Technology, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
- Publication number 20190109018
- Publication date Apr 11, 2019
- Amkor Technology, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20180247909
- Publication date Aug 30, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20180047692
- Publication date Feb 15, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS

Daniel Richter

Person

Patents Grantslast 30 patents

Electronic device with top side pin array and manufacturing method...

Electronic device with top side pin array and manufacturing method...

Method and system for packing optimization of semiconductor devices

Electronic device with top side pin array and manufacturing method...

Patents Applicationslast 30 patents

Die-Attach Fillet Height Reduction

Semiconductor Package

Thermal Enhanced Power Semiconductor Package

POWER SEMICONDUCTOR DEVICES HAVING MOISTURE BARRIERS

DIE BACKSIDE METALLIZATION METHODS AND APPARATUS

ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...

Method and System for Packing Optimization of Semiconductor Devices

ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...

ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...

Method and System for Packing Optimization of Semiconductor Devices

Method and System for Packing Optimization of Semiconductor Devices