Daniel S. Vanslette

Person

Highgate Springs, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a metal silicide transparent conductive electrode
- Patent number 11,195,969
- Issue date Dec 7, 2021
- International Business Machines Corporation
- Jeffrey P. Gambino
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of forming a metal silicide transparent conductive electrode
- Patent number 11,056,610
- Issue date Jul 6, 2021
- International Business Machines Corporation
- Jeffrey P. Gambino
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of forming a metal silicide transparent conductive electrode
- Patent number 10,147,839
- Issue date Dec 4, 2018
- International Business Machines Corporation
- Jeffrey P. Gambino
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Wafer frontside-backside through silicon via
- Patent number 9,455,214
- Issue date Sep 27, 2016
- GLOBALFOUNDRIES Inc.
- Jeffrey C. Maling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of eliminating poor reveal of through silicon vias
- Patent number 9,443,764
- Issue date Sep 13, 2016
- GLOBALFOUNDRIES, INC.
- Jeffrey C. Maling
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit and design structure having reduced through sili...
- Patent number 9,406,562
- Issue date Aug 2, 2016
- GLOBALFOUNDRIES, INC.
- Jeffrey P. Bonn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit and interconnect, and method of fabricating same
- Patent number 9,390,969
- Issue date Jul 12, 2016
- GLOBALFOUNDRIES, INC.
- David A. DeMuynck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure with a metal silicide transparent conductive electrode an...
- Patent number 9,312,426
- Issue date Apr 12, 2016
- International Business Machines Corporation
- Jeffrey P. Gambino
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Through silicon via wafer, contacts and design structures
- Patent number 9,245,850
- Issue date Jan 26, 2016
- GLOBALFOUNDRIES Inc.
- Jeffrey P. Gambino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Through silicon via wafer and methods of manufacturing
- Patent number 9,041,210
- Issue date May 26, 2015
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controlling wafer curvature
- Patent number 8,918,988
- Issue date Dec 30, 2014
- International Business Machines Corporation
- Mohammed Fazil Fayaz
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device including in wafer inductors, related method a...
- Patent number 8,809,998
- Issue date Aug 19, 2014
- International Business Machines Corporation
- Renata A. Camillo-Castillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via wafer, contacts and design structures
- Patent number 8,791,016
- Issue date Jul 29, 2014
- International Business Machines Corporation
- Jeffrey P. Gambino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and structures for controlling wafer curvature
- Patent number 8,299,615
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Mohammed Fazil Fayaz
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated structures of high performance active devices and passiv...
- Patent number 8,232,139
- Issue date Jul 31, 2012
- International Business Machines Corporation
- Robert M. Rassel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures of high performance active devices and passiv...
- Patent number 8,188,591
- Issue date May 29, 2012
- International Business Machines Corporation
- Robert M. Rassel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant aluminum-based metal interconnect structure
- Patent number 8,084,864
- Issue date Dec 27, 2011
- International Business Machines Corporation
- Jonathan D. Chapple-Sokol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneously formed isolation trench and through-box contact for...
- Patent number 8,021,943
- Issue date Sep 20, 2011
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant aluminum-based metal interconnect structure
- Patent number 8,003,536
- Issue date Aug 23, 2011
- International Business Machines Corporation
- Jonathan D. Chapple-Sokol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming refractory metal contact in an opening, and resul...
- Patent number 6,900,505
- Issue date May 31, 2005
- International Business Machines Corporation
- Jonanthan D. Chapple-Sokol
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtered tungsten diffusion barrier for improved interconnect robu...
- Patent number 6,838,364
- Issue date Jan 4, 2005
- International Business Machines Corporation
- Stephen B. Brodsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming refractory metal contact in an opening, and resul...
- Patent number 6,762,121
- Issue date Jul 13, 2004
- International Business Machines Corporation
- Jonathan D. Chapple-Sokol
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtered tungsten diffusion barrier for improved interconnect robu...
- Patent number 6,245,668
- Issue date Jun 12, 2001
- International Business Machines Corporation
- Stephen B. Brodsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method of forming a metal silicide transparent conductive electrode
- Publication number 20180358504
- Publication date Dec 13, 2018
- International Business Machines Corporation
- Jeffrey P. Gambino
- B82 - NANO-TECHNOLOGY
Information Patent Application
Method of forming a metal silicide transparent conductive electrode
- Publication number 20180342642
- Publication date Nov 29, 2018
- International Business Machines Corporation
- Jeffrey P. Gambino
- B82 - NANO-TECHNOLOGY
Information Patent Application
ELECTROSTATIC SUBSTRATE HOLDER WITH NON-PLANAR SURFACE AND METHOD O...
- Publication number 20170069518
- Publication date Mar 9, 2017
- GLOBALFOUNDRIES INC.
- Brett Cucci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH A METAL SILICIDE TRASPARENT CONDUCTIVE ELECTRODE AND...
- Publication number 20150357512
- Publication date Dec 10, 2015
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER FRONTSIDE-BACKSIDE THROUGH SILICON VIA
- Publication number 20150332966
- Publication date Nov 19, 2015
- International Business Machines Corporation
- Jeffrey C. MALING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND INTERCONNECT, AND METHOD OF FABRICATING SAME
- Publication number 20150140809
- Publication date May 21, 2015
- International Business Machines Corporation
- David A. DeMuynck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELIMINATING POOR REVEAL OF THROUGH SILICON VIAS
- Publication number 20150101856
- Publication date Apr 16, 2015
- International Business Machines Corporation
- Jeffrey C. Maling
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THROUGH SILICON VIA WAFER, CONTACTS AND DESIGN STRUCTURES
- Publication number 20140284816
- Publication date Sep 25, 2014
- International Business Machines Corporation
- Jeffrey P. Gambino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THROUGH SILICON VIA WAFER, CONTACTS AND DESIGN STRUCTURES
- Publication number 20140087557
- Publication date Mar 27, 2014
- International Business Machines Corporation
- Jeffrey P. Gambino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THROUGH SILICON VIA WAFER AND METHODS OF MANUFACTURING
- Publication number 20130334701
- Publication date Dec 19, 2013
- International Business Machines Corporation
- Jeffrey P. GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH A METAL SILICIDE TRANSPARENT CONDUCTIVE ELECTRODE AN...
- Publication number 20130146335
- Publication date Jun 13, 2013
- International Business Machines Corporation
- Jeffrey P. Gambino
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING IN WAFER INDUCTORS, RELATED METHOD A...
- Publication number 20130105941
- Publication date May 2, 2013
- International Business Machines Corporation
- Daniel S. Vanslette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR CONTROLLING WAFER CURVATURE
- Publication number 20120329265
- Publication date Dec 27, 2012
- International Business Machines Corporation
- Mohammed Fazil Fayaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STRUCTURES OF HIGH PERFORMANCE ACTIVE DEVICES AND PASSIV...
- Publication number 20120192139
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Robert M. Rassel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND DESIGN STRUCTURE HAVING REDUCED THROUGH SILI...
- Publication number 20120181700
- Publication date Jul 19, 2012
- International Business Machines Corporation
- Jeffrey P. Bonn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT AND INTERCONNECT, AND METHOD OF FABRICATING SAME
- Publication number 20120086101
- Publication date Apr 12, 2012
- International Business Machines Corporation
- David A. DeMuynck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STRUCTURES OF HIGH PERFORMANCE ACTIVE DEVICES AND PASSIV...
- Publication number 20120013017
- Publication date Jan 19, 2012
- International Business Machines Corporation
- Robert M. Rassel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT ALUMINUM-BASED METAL INTERCONNECT STRUCTURE
- Publication number 20110221064
- Publication date Sep 15, 2011
- International Business Machines Corporation
- Jonathan D. Chapple-Sokol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUSLY FORMED ISOLATION TRENCH AND THROUGH-BOX CONTACT FOR...
- Publication number 20110124177
- Publication date May 26, 2011
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR CONTROLLING WAFER CURVATURE
- Publication number 20110049723
- Publication date Mar 3, 2011
- International Business Machines Corporation
- Mohammed Fazil Fayaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT ALUMINUM-BASED METAL INTERCONNECT STRUCTURE
- Publication number 20100237503
- Publication date Sep 23, 2010
- International Business Machines Corporation
- Jonathan D. Chapple-Sokol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN LINER FOR ALUMINUM-BASED ELECTROMIGRATION RESISTANT INTERC...
- Publication number 20090230555
- Publication date Sep 17, 2009
- International Business Machines Corporation
- Jonathan D. Chapple-Sokol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING REFRACTORY METAL CONTACT IN AN OPENING, AND RESUL...
- Publication number 20040191562
- Publication date Sep 30, 2004
- International Business Machines Corporation
- Jonathan Chapple-Sokol
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of forming refractory metal contact in an opening, and resul...
- Publication number 20030165705
- Publication date Sep 4, 2003
- International Business Machines Corporation
- Jonathan D. Chapple-Sokol
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for utilizing tungsten barrier in contacts to silicide and s...
- Publication number 20020175413
- Publication date Nov 28, 2002
- International Business Machines Corporation
- Louis D. Lanzerotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Version with markings to show changes made
- Publication number 20010029096
- Publication date Oct 11, 2001
- International Business Machines Corporation
- Stephen B. Brodsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Daniel S. Vanslette

Person

Patents Grantslast 30 patents

Method of forming a metal silicide transparent conductive electrode

Method of forming a metal silicide transparent conductive electrode

Method of forming a metal silicide transparent conductive electrode

Wafer frontside-backside through silicon via

Method of eliminating poor reveal of through silicon vias

Integrated circuit and design structure having reduced through sili...

Integrated circuit and interconnect, and method of fabricating same

Structure with a metal silicide transparent conductive electrode an...

Through silicon via wafer, contacts and design structures

Through silicon via wafer and methods of manufacturing

Methods for controlling wafer curvature

Semiconductor device including in wafer inductors, related method a...

Through silicon via wafer, contacts and design structures

Methods and structures for controlling wafer curvature

Integrated structures of high performance active devices and passiv...

Integrated structures of high performance active devices and passiv...

Electromigration resistant aluminum-based metal interconnect structure

Simultaneously formed isolation trench and through-box contact for...

Electromigration resistant aluminum-based metal interconnect structure

Method of forming refractory metal contact in an opening, and resul...

Sputtered tungsten diffusion barrier for improved interconnect robu...

Method of forming refractory metal contact in an opening, and resul...

Sputtered tungsten diffusion barrier for improved interconnect robu...

Patents Applicationslast 30 patents

Method of forming a metal silicide transparent conductive electrode

Method of forming a metal silicide transparent conductive electrode

ELECTROSTATIC SUBSTRATE HOLDER WITH NON-PLANAR SURFACE AND METHOD O...

STRUCTURE WITH A METAL SILICIDE TRASPARENT CONDUCTIVE ELECTRODE AND...

WAFER FRONTSIDE-BACKSIDE THROUGH SILICON VIA

INTEGRATED CIRCUIT AND INTERCONNECT, AND METHOD OF FABRICATING SAME

ELIMINATING POOR REVEAL OF THROUGH SILICON VIAS

THROUGH SILICON VIA WAFER, CONTACTS AND DESIGN STRUCTURES

THROUGH SILICON VIA WAFER, CONTACTS AND DESIGN STRUCTURES

THROUGH SILICON VIA WAFER AND METHODS OF MANUFACTURING

STRUCTURE WITH A METAL SILICIDE TRANSPARENT CONDUCTIVE ELECTRODE AN...

SEMICONDUCTOR DEVICE INCLUDING IN WAFER INDUCTORS, RELATED METHOD A...

METHODS AND STRUCTURES FOR CONTROLLING WAFER CURVATURE

INTEGRATED STRUCTURES OF HIGH PERFORMANCE ACTIVE DEVICES AND PASSIV...

INTEGRATED CIRCUIT AND DESIGN STRUCTURE HAVING REDUCED THROUGH SILI...

INTEGRATED CIRCUIT AND INTERCONNECT, AND METHOD OF FABRICATING SAME

INTEGRATED STRUCTURES OF HIGH PERFORMANCE ACTIVE DEVICES AND PASSIV...

ELECTROMIGRATION RESISTANT ALUMINUM-BASED METAL INTERCONNECT STRUCTURE

SIMULTANEOUSLY FORMED ISOLATION TRENCH AND THROUGH-BOX CONTACT FOR...

METHODS AND STRUCTURES FOR CONTROLLING WAFER CURVATURE

ELECTROMIGRATION RESISTANT ALUMINUM-BASED METAL INTERCONNECT STRUCTURE

TUNGSTEN LINER FOR ALUMINUM-BASED ELECTROMIGRATION RESISTANT INTERC...

METHOD OF FORMING REFRACTORY METAL CONTACT IN AN OPENING, AND RESUL...

Method of forming refractory metal contact in an opening, and resul...

Method for utilizing tungsten barrier in contacts to silicide and s...

Version with markings to show changes made