Daniel Schleisser

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Munchen, DE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with leadframe
- Patent number 10,319,671
- Issue date Jun 11, 2019
- Infineon Technologies AG
- Dirk Ahlers
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Transistor package with terminals coupled via chip carrier
- Patent number 9,978,672
- Issue date May 22, 2018
- Infineon Technologies AG
- Dirk Ahlers
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE
- Publication number 20240040689
- Publication date Feb 1, 2024
- INFINEON TECHNOLOGIES AG
- Ramdas Rangnath Ugale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Leadframe
- Publication number 20180342447
- Publication date Nov 29, 2018
- INFINEON TECHNOLOGIES AG
- Dirk Ahlers
- B60 - VEHICLES IN GENERAL