Daniel Stofman

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East Brunswick, NJ, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer demount receptable for separation of thinned wafer from mount...
- Patent number 6,554,949
- Issue date Apr 29, 2003
- Anadigics, Inc.
- Bhola De
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer demount receptacle for separation of thinned wafer from mount...
- Patent number 6,491,083
- Issue date Dec 10, 2002
- Anadigics, Inc.
- Bhola De
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wafer demount receptacle for separation of thinned wafer from mount...
- Publication number 20030015286
- Publication date Jan 23, 2003
- Anadigics, Inc.
- Bhola De
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer demount receptacle for separation of thinned wafer from mount...
- Publication number 20020104616
- Publication date Aug 8, 2002
- Bhola De
- H01 - BASIC ELECTRIC ELEMENTS