Daniel T. Rooney

Follow

Person

Schaumburg, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Process to reform a plastic packaged integrated circuit die
- Patent number 7,434,310
- Issue date Oct 14, 2008
- Motorola, Inc.
- Timothy B. Dean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overmolded electronic assembly and overmoldable interface component
- Patent number 7,390,978
- Issue date Jun 24, 2008
- Motorola, Inc.
- Timothy B. Dean
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-board electronic assembly including spacer for multiple elect...
- Patent number 5,825,633
- Issue date Oct 20, 1998
- Motorola, Inc.
- C. Gregory Bujalski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESS FOR REFORMING A PLASTIC PACKAGED INTEGRATED CIRCUIT DIE AND...
- Publication number 20070278676
- Publication date Dec 6, 2007
- MOTOROLA, INC.
- Timothy B. Dean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Overmolded electronic assembly and overmoldable interface component
- Publication number 20060141828
- Publication date Jun 29, 2006
- Timothy B. Dean
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR