Daniel Wayne Levesque

Person

Bath, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Micro-perforated panel systems, applications, and methods of making...
- Patent number 11,608,291
- Issue date Mar 21, 2023
- Corning Incorporated
- Andres Covarrubias Jaramillo
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Inorganic wafer having through-holes attached to semiconductor wafer
- Patent number 10,756,003
- Issue date Aug 25, 2020
- Corning Incorporated
- Daniel Wayne Levesque
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for reducing substrate surface disruption durin...
- Patent number 10,424,606
- Issue date Sep 24, 2019
- Corning Incorporated
- Sean Matthew Garner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Articles having holes with morphology attributes and methods for fa...
- Patent number 10,366,904
- Issue date Jul 30, 2019
- Corning Incorporated
- Andres Covarrubias Jaramillo
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Inorganic wafer having through-holes attached to semiconductor wafer
- Patent number 10,134,657
- Issue date Nov 20, 2018
- Corning Incorporated
- Daniel Wayne Levesque
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of etching glass substrates and glass substrates
- Patent number 10,077,206
- Issue date Sep 18, 2018
- Corning Incorporated
- Thomas Michael Castle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
GLASS CERAMIC SUBSTRATE WITH THROUGH-GLASS VIA
- Publication number 20240351945
- Publication date Oct 24, 2024
- Corning Incorporated
- Daniel Wayne Levesque
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESI...
- Publication number 20230402337
- Publication date Dec 14, 2023
- Corning Incorporated
- Jin Su Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FORMING WRAP AROUND ELECTRODES
- Publication number 20230341986
- Publication date Oct 26, 2023
- Corning Incorporated
- Ya-Huei Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICRO-PERFORATED PANEL SYSTEMS, APPLICATIONS, AND METHODS OF MAKING...
- Publication number 20200262742
- Publication date Aug 20, 2020
- Corning Incorporated
- Andres Covarrubias Jaramillo
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
SYSTEMS AND METHODS FOR REDUCING SUBSTRATE SURFACE DISRUPTION DURIN...
- Publication number 20190312067
- Publication date Oct 10, 2019
- Corning Incorporated
- Sean Matthew Garner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING PULSED LA...
- Publication number 20190119150
- Publication date Apr 25, 2019
- Corning Incorporated
- Robert Carl Burket
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
INORGANIC WAFER HAVING THROUGH-HOLES ATTACHED TO SEMICONDUCTOR WAFER
- Publication number 20190074240
- Publication date Mar 7, 2019
- Corning Incorporated
- Daniel Wayne Levesque
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SILICA TEST PROBE AND OTHER SUCH DEVICES
- Publication number 20180105455
- Publication date Apr 19, 2018
- Corning Incorporated
- Daniel Wayne Levesque
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
ARTICLES HAVING HOLES WITH MORPHOLOGY ATTRIBUTES AND METHODS FOR FA...
- Publication number 20180068868
- Publication date Mar 8, 2018
- Corning Incorporated
- Andres Covarrubias Jaramillo
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
INORGANIC WAFER HAVING THROUGH-HOLES ATTACHED TO SEMICONDUCTOR WAFER
- Publication number 20180005922
- Publication date Jan 4, 2018
- Corning Incorporated
- Daniel Wayne Levesque
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS OF ETCHING GLASS SUBSTRATES AND GLASS SUBSTRATES
- Publication number 20160362331
- Publication date Dec 15, 2016
- Corning Incorporated
- Thomas Michael Castle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Daniel Wayne Levesque

Person

Patents Grantslast 30 patents

Micro-perforated panel systems, applications, and methods of making...

Inorganic wafer having through-holes attached to semiconductor wafer

Systems and methods for reducing substrate surface disruption durin...

Articles having holes with morphology attributes and methods for fa...

Inorganic wafer having through-holes attached to semiconductor wafer

Methods of etching glass substrates and glass substrates

Patents Applicationslast 30 patents

GLASS CERAMIC SUBSTRATE WITH THROUGH-GLASS VIA

3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESI...

SYSTEMS AND METHODS FOR FORMING WRAP AROUND ELECTRODES

MICRO-PERFORATED PANEL SYSTEMS, APPLICATIONS, AND METHODS OF MAKING...

SYSTEMS AND METHODS FOR REDUCING SUBSTRATE SURFACE DISRUPTION DURIN...

METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING PULSED LA...

INORGANIC WAFER HAVING THROUGH-HOLES ATTACHED TO SEMICONDUCTOR WAFER

SILICA TEST PROBE AND OTHER SUCH DEVICES

ARTICLES HAVING HOLES WITH MORPHOLOGY ATTRIBUTES AND METHODS FOR FA...

INORGANIC WAFER HAVING THROUGH-HOLES ATTACHED TO SEMICONDUCTOR WAFER

METHODS OF ETCHING GLASS SUBSTRATES AND GLASS SUBSTRATES