Daniel Yap

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Solder mask for thermal pad of a printed circuit board to provide r...
- Patent number 11,244,892
- Issue date Feb 8, 2022
- STMicroelectronics Pte Ltd
- Daniel Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for an integrated circuit chip
- Patent number 6,621,151
- Issue date Sep 16, 2003
- Institute of Microelectronics
- Tai Chong Chai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for an integrated circuit chip (integrated circuit perip...
- Patent number 6,583,501
- Issue date Jun 24, 2003
- Institute of Microelectronics
- Tai Chong Chai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER MASK FOR THERMAL PAD OF A PRINTED CIRCUIT BOARD TO PROVIDE R...
- Publication number 20220130750
- Publication date Apr 28, 2022
- STMicroelectronics Pte Ltd
- Daniel Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MASK FOR THERMAL PAD OF A PRINTED CIRCUIT BOARD TO PROVIDE R...
- Publication number 20200075475
- Publication date Mar 5, 2020
- STMicroelectronics Pte Ltd
- Daniel Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame for an integrated circuit chip (integrated circuit perip...
- Publication number 20020163078
- Publication date Nov 7, 2002
- Tai-Chong Chai
- H01 - BASIC ELECTRIC ELEMENTS