Danish FARUQUI

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,859,248
- Issue date Jan 2, 2018
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic thin film passivation of metal interconnections
- Patent number 9,824,991
- Issue date Nov 21, 2017
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ablation method and recipe for wafer level underfill material patte...
- Patent number 9,786,517
- Issue date Oct 10, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic thin film passivation of metal interconnections
- Patent number 9,583,390
- Issue date Feb 28, 2017
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,412,702
- Issue date Aug 9, 2016
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic thin film passivation of metal interconnections
- Patent number 9,257,276
- Issue date Feb 9, 2016
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS
- Publication number 20170141061
- Publication date May 18, 2017
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20160307869
- Publication date Oct 20, 2016
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS
- Publication number 20160155667
- Publication date Jun 2, 2016
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRATHIN MICROELECTRONIC DIE PACKAGES AND METHODS OF FABRICATING T...
- Publication number 20150318255
- Publication date Nov 5, 2015
- OMKAR G. KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ABLATION METHOD AND RECIPE FOR WAFER LEVEL UNDERFILL MATERIAL PATTE...
- Publication number 20150072479
- Publication date Mar 12, 2015
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION METHOD AND RECIPE FOR SACRIFICIAL MATERIAL PATTERNIN...
- Publication number 20150072515
- Publication date Mar 12, 2015
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20140264951
- Publication date Sep 18, 2014
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS
- Publication number 20140138818
- Publication date May 22, 2014
- Alexsandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS

Danish FARUQUI

Person

Patents Grantslast 30 patents

Laser die backside film removal for integrated circuit (IC) packaging

Organic thin film passivation of metal interconnections

Ablation method and recipe for wafer level underfill material patte...

Organic thin film passivation of metal interconnections

Laser die backside film removal for integrated circuit (IC) packaging

Organic thin film passivation of metal interconnections

Patents Applicationslast 30 patents

ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS

LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING

ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS

ULTRATHIN MICROELECTRONIC DIE PACKAGES AND METHODS OF FABRICATING T...

ABLATION METHOD AND RECIPE FOR WAFER LEVEL UNDERFILL MATERIAL PATTE...

LASER ABLATION METHOD AND RECIPE FOR SACRIFICIAL MATERIAL PATTERNIN...

LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING

ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS