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Danny E. Massey
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Austin, TX, US
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Patents Grants
last 30 patents
Information
Patent Grant
Topside installation apparatus for land grid array modules
Patent number
6,802,733
Issue date
Oct 12, 2004
International Business Machines Corporation
John L. Colbert
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of installing a land grid array multi-chip modules
Patent number
6,757,965
Issue date
Jul 6, 2004
International Business Machines Corporation
John L. Colbert
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus for mounting a land grid array module
Patent number
6,634,095
Issue date
Oct 21, 2003
International Business Machines Corporation
John L. Colbert
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Land grid array socket actuation hardware for MCM applications
Patent number
6,475,011
Issue date
Nov 5, 2002
International Business Machines Corporation
Arvind K. Sinha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Land grid array subassembly for multichip modules
Patent number
6,449,155
Issue date
Sep 10, 2002
International Business Machines Corporation
John Lee Colbert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat pipe heat sink assembly for cooling semiconductor chips
Patent number
6,385,044
Issue date
May 7, 2002
International Business Machines Corporation
John Lee Colbert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heatsink grounding spring and shield apparatus
Patent number
6,278,615
Issue date
Aug 21, 2001
International Business Machines Corporation
Johnny Roy Brezina
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Socket for semi-permanently connecting a solder ball grid array dev...
Patent number
5,770,891
Issue date
Jun 23, 1998
International Business Machines Corporation
Richard Francis Frankeny
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Self-alligning low profile socket for connecting ball grid array de...
Patent number
5,738,531
Issue date
Apr 14, 1998
International Business Machines Corporation
Daniel Paul Beaman
G01 - MEASURING TESTING
Information
Patent Grant
Socket for semi-permanently connecting a solder ball grid array dev...
Patent number
5,691,041
Issue date
Nov 25, 1997
International Business Machines Corporation
Richard Francis Frankeny
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Holding member for the installation of land grid array multi-chip m...
Publication number
20030192180
Publication date
Oct 16, 2003
John L. Colbert
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Topside Installation apparatus for land grid array modules
Publication number
20030036301
Publication date
Feb 20, 2003
International Business Machines Corporation
John L. Colbert
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Holding member for the installation of land grid array multi-chip m...
Publication number
20030000080
Publication date
Jan 2, 2003
International Business Machines Corporation
John L. Colbert
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC