Danny Retuta

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Tustin, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with under bump metallization aligned with op...
- Patent number 8,030,768
- Issue date Oct 4, 2011
- United Test & Assembly Center Ltd.
- Roel Robles
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BUMP ON VIA-PACKAGING AND METHODOLOGIES
- Publication number 20080284015
- Publication date Nov 20, 2008
- United Test and Assembly Center, Ltd.
- Roel Robles
- H01 - BASIC ELECTRIC ELEMENTS