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last 30 patents
Information
Patent Grant
Integrated circuit packaging system with substrate and method of ma...
Patent number
10,109,587
Issue date
Oct 23, 2018
STATS ChipPAC Pte. Ltd.
Dao Nguyen Phu Cuong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with photoimagable dielectric-d...
Patent number
9,679,769
Issue date
Jun 13, 2017
STATS ChipPAC Pte. Ltd.
Zigmund Ramirez Camacho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with interposer structure and m...
Patent number
9,659,897
Issue date
May 23, 2017
STATS ChipPAC Pte. Ltd.
Zigmund Ramirez Camacho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with support structure and meth...
Patent number
9,502,267
Issue date
Nov 22, 2016
STATS ChipPAC Pte. Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with substrate and method of ma...
Patent number
9,412,624
Issue date
Aug 9, 2016
STATS ChipPAC Pte. Ltd.
Dao Nguyen Phu Cuong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with photoimagable dielectric-d...
Patent number
9,406,531
Issue date
Aug 2, 2016
STATS ChipPAC Pte. Ltd.
Zigmund Ramirez Camacho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with insulated trace and method...
Patent number
9,406,642
Issue date
Aug 2, 2016
Stats Chippac Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with interposer structure and m...
Patent number
9,355,983
Issue date
May 31, 2016
Stats Chippac Ltd.
Zigmund Ramirez Camacho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with pre-molded leadframe and m...
Patent number
9,331,003
Issue date
May 3, 2016
Stats Chippac Ltd.
Zigmund Ramirez Camacho
H01 - BASIC ELECTRIC ELEMENTS