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Daqiao Du
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Lake Oswego, OR, US
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Patents Grants
last 30 patents
Information
Patent Grant
Packed interconnect structure with reduced cross coupled noise
Patent number
10,950,536
Issue date
Mar 16, 2021
Intel Corporation
Zhen Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board (PCB) with three-dimensional interconnects to...
Patent number
10,617,000
Issue date
Apr 7, 2020
Intel Corporation
Daqiao Du
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous interconnect having linear and non-linear conductive...
Patent number
10,157,822
Issue date
Dec 18, 2018
Intel Corporation
Zhen Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Board integrated interconnect
Patent number
10,074,919
Issue date
Sep 11, 2018
Intel Corporation
Zhen Zhou
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PHASE HETEROGENEOUS INTERCONNECTS FOR CROSSTALK REDUCTION
Publication number
20220338344
Publication date
Oct 20, 2022
Intel Corporation
Zhen Zhou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SHIELDED FINE-PITCH HIGH-PERFORMANCE IMPEDANCE TUNABLE INTERCONNECT
Publication number
20220244291
Publication date
Aug 4, 2022
Ismael Franco
B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information
Patent Application
NEAR FIELD WIRELESS COMMUNICATION SYSTEM FOR MOTHER TO PACKAGE AND...
Publication number
20220206064
Publication date
Jun 30, 2022
Intel Corporation
Zhen ZHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL INTERCONNECT WITH IMPROVED IMPEDANCE
Publication number
20220013944
Publication date
Jan 13, 2022
Intel Corporation
Daqiao Du
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAVE SPRING-BASED INTERCONNECT PROBES
Publication number
20210351535
Publication date
Nov 11, 2021
Intel Corporation
Ismael Franco Núñez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD (PCB) WITH THREE-DIMENSIONAL INTERCONNECTS TO...
Publication number
20190037689
Publication date
Jan 31, 2019
Intel Corporation
DAQIAO DU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR