Daquan Yu

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Wuxi City, CN

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Patents Grantslast 30 patents

Information Patent Grant
Mechanical debonding method and system
- Patent number 9,368,376
- Issue date Jun 14, 2016
- National Center for Advanced Packaging Co., Ltd.
- Daquan Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for removing electroplated metal facets and reusing a barrie...
- Patent number 9,293,368
- Issue date Mar 22, 2016
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Kai Xue
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR REMOVING ELECTROPLATED METAL FACETS AND REUSING A BARRIE...
- Publication number 20150072516
- Publication date Mar 12, 2015
- National Center for Advanced Packaging Co., Ltd.
- Kai Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV Front-top Interconnection Process
- Publication number 20140370703
- Publication date Dec 18, 2014
- Fengwei Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mechanical Debonding Method and System
- Publication number 20140356988
- Publication date Dec 4, 2014
- Daquan Yu
- H01 - BASIC ELECTRIC ELEMENTS