Daragh S. Finn

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Laser scan sequencing and direction with respect to gas flow
- Patent number 10,328,529
- Issue date Jun 25, 2019
- Electro Scientific Industries, Inc.
- Daragh Finn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate containing aperture and methods of forming the same
- Patent number 8,894,868
- Issue date Nov 25, 2014
- Electro Scientific Industries, Inc.
- Andy Hooper
- B44 - DECORATIVE ARTS
Information Patent Grant
Etching a laser-cut semiconductor before dicing a die attach film (...
- Patent number 8,800,475
- Issue date Aug 12, 2014
- Electro Scientific Industries, Inc.
- Daragh S. Finn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for laser singulation of brittle materials
- Patent number 8,679,948
- Issue date Mar 25, 2014
- Electro Scientific Industries, Inc.
- Yasu Osako
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etching a laser-cut semiconductor before dicing a die attach film (...
- Patent number 8,673,741
- Issue date Mar 18, 2014
- Electro Scientific Industries, Inc.
- Daragh S. Finn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon etching control method and system
- Patent number 8,666,530
- Issue date Mar 4, 2014
- Electro Scientific Industries, Inc.
- Daragh Seosamh Finn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for laser processing a workpiece using a plural...
- Patent number 8,598,490
- Issue date Dec 3, 2013
- Electro Scientific Industries, Inc.
- Andrew Hooper
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for laser singulation of brittle materials
- Patent number 8,383,984
- Issue date Feb 26, 2013
- Electro Scientific Industries, Inc.
- Yasu Osako
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LASER PROCESSING APPARATUS, METHODS OF OPERATING THE SAME, AND METH...
- Publication number 20220168847
- Publication date Jun 2, 2022
- ELECTRO SCIENTIFIC INDUSTRIES, INC.
- Jan KLEINERT
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING APPARATUS AND METHODS OF LASER-PROCESSING WORKPIECES
- Publication number 20210331273
- Publication date Oct 28, 2021
- Electro Scientific Industries, Inc.
- Daragh Finn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER SCAN SEQUENCING AND DIRECTION WITH RESPECT TO GAS FLOW
- Publication number 20170057016
- Publication date Mar 2, 2017
- Electro Scientific Industries, Inc.
- Daragh Finn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ETCHING A LASER-CUT SEMICONDUCTOR BEFORE DICING A DIE ATTACH FILM (...
- Publication number 20140182786
- Publication date Jul 3, 2014
- Electro Scientific Industries, Inc.
- Daragh S. Finn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR LASER SINGULATION OF BRITTLE MATERIALS
- Publication number 20130237035
- Publication date Sep 12, 2013
- ELECTRO SCIENTIFIC, INDUSTRIES, INC.
- Yasu OSAKO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE CONTAINING APERTURE AND METHODS OF FORMING THE SAME
- Publication number 20130089701
- Publication date Apr 11, 2013
- Electro Scientific Industries, Inc.
- Andy Hooper
- B44 - DECORATIVE ARTS
Information Patent Application
ETCHING A LASER-CUT SEMICONDUCTOR BEFORE DICING A DIE ATTACH FILM (...
- Publication number 20120329246
- Publication date Dec 27, 2012
- Electro Scientific Industries, Inc.
- Daragh S. Finn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLOSED-LOOP SILICON ETCHING CONTROL METHOD AND SYSTEM
- Publication number 20120158169
- Publication date Jun 21, 2012
- Electro Scientific Industries, Inc.
- Daragh S. Finn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR LASER PROCESSING A WORKPIECE USING A PLURAL...
- Publication number 20110298156
- Publication date Dec 8, 2011
- Electro Scientific Industries, Inc.
- Andrew Hooper
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR IMPROVED WAFER SINGULATION
- Publication number 20110287607
- Publication date Nov 24, 2011
- Electro Scientific Industries, Inc.
- Yasu Osako
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR LASER SINGULATION OF BRITTLE MATERIALS
- Publication number 20110240616
- Publication date Oct 6, 2011
- Electro Scientific Industries, Inc.
- Yasu Osako
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Daragh S. Finn

Person

Patents Grantslast 30 patents

Laser scan sequencing and direction with respect to gas flow

Substrate containing aperture and methods of forming the same

Etching a laser-cut semiconductor before dicing a die attach film (...

Method and apparatus for laser singulation of brittle materials

Etching a laser-cut semiconductor before dicing a die attach film (...

Silicon etching control method and system

Methods and systems for laser processing a workpiece using a plural...

Method and apparatus for laser singulation of brittle materials

Patents Applicationslast 30 patents

LASER PROCESSING APPARATUS, METHODS OF OPERATING THE SAME, AND METH...

LASER PROCESSING APPARATUS AND METHODS OF LASER-PROCESSING WORKPIECES

LASER SCAN SEQUENCING AND DIRECTION WITH RESPECT TO GAS FLOW

ETCHING A LASER-CUT SEMICONDUCTOR BEFORE DICING A DIE ATTACH FILM (...

METHOD AND APPARATUS FOR LASER SINGULATION OF BRITTLE MATERIALS

SUBSTRATE CONTAINING APERTURE AND METHODS OF FORMING THE SAME

ETCHING A LASER-CUT SEMICONDUCTOR BEFORE DICING A DIE ATTACH FILM (...

CLOSED-LOOP SILICON ETCHING CONTROL METHOD AND SYSTEM

METHODS AND SYSTEMS FOR LASER PROCESSING A WORKPIECE USING A PLURAL...

METHOD AND APPARATUS FOR IMPROVED WAFER SINGULATION

METHOD AND APPARATUS FOR LASER SINGULATION OF BRITTLE MATERIALS