Dario S. Filoteo, JR.

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package system having interconnect stack and ext...
- Patent number 8,138,080
- Issue date Mar 20, 2012
- Stats Chippac Ltd.
- Dario S. Filoteo, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming quad flat package
- Patent number 8,097,496
- Issue date Jan 17, 2012
- STATS ChipPAC, Ltd.
- Emmanuel A. Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat package
- Patent number 8,097,935
- Issue date Jan 17, 2012
- STATS ChipPAC, Ltd.
- Emmanuel A. Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with open substrate
- Patent number 8,030,783
- Issue date Oct 4, 2011
- ST Assembly Test Services Ltd.
- Il Kwon Shim
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stacked integrated circuits package system with passive components
- Patent number 8,026,129
- Issue date Sep 27, 2011
- Stats Chippac Ltd.
- Philip Lyndon Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct via wire bonding and method of assembling the same
- Patent number 8,021,931
- Issue date Sep 20, 2011
- Stats Chippac, Inc.
- Dario S. Filoteo, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip module package and fabrication method
- Patent number 7,928,564
- Issue date Apr 19, 2011
- Stats Chippac Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer
- Patent number 7,911,046
- Issue date Mar 22, 2011
- Stats Chippac Ltd.
- Philip Lyndon Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array-molded package heat spreader and fabrication method therefor
- Patent number 7,863,730
- Issue date Jan 4, 2011
- ST Assembly Test Services Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die semiconductor device having circuit tape
- Patent number 7,786,575
- Issue date Aug 31, 2010
- Stats Chippac Ltd.
- Philip Lyndon R. Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit heat spreader stacking method
- Patent number 7,759,169
- Issue date Jul 20, 2010
- Stats Chippac Ltd.
- Dario S. Filoteo, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat package
- Patent number 7,687,892
- Issue date Mar 30, 2010
- STATS ChipPAC, Ltd.
- Emmanuel A. Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die semiconductor device having circuit tape
- Patent number 7,659,608
- Issue date Feb 9, 2010
- Stats Chippac Ltd.
- Philip Lyndon R. Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with open substrate
- Patent number 7,626,277
- Issue date Dec 1, 2009
- ST Assembly Test Services Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system including high-density small foot...
- Patent number 7,622,325
- Issue date Nov 24, 2009
- Stats Chippac Ltd.
- IL Kwon Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package system including die stacking
- Patent number 7,619,314
- Issue date Nov 17, 2009
- Stats Chippac Ltd.
- Dario S. Filoteo, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer
- Patent number 7,518,226
- Issue date Apr 14, 2009
- Stats Chippac Ltd.
- Philip Lyndon Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip module package and fabrication method
- Patent number 7,445,955
- Issue date Nov 4, 2008
- Stats Chippac Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package-in-package system
- Patent number 7,439,620
- Issue date Oct 21, 2008
- Stats Chippac Ltd.
- Leo A. Merilo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system including die stacking
- Patent number 7,298,038
- Issue date Nov 20, 2007
- Stats Chippac Ltd.
- Dario S. Filoteo, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package with open substrate
- Patent number 7,008,820
- Issue date Mar 7, 2006
- ST Assembly Test Services Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip module package and fabrication method
- Patent number 6,943,057
- Issue date Sep 13, 2005
- Stats Chippac Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH OPEN SUBSTRATE AND METHOD OF MANUFA...
- Publication number 20120018886
- Publication date Jan 26, 2012
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Scale Module Package in BGA Semiconductor Package
- Publication number 20110001240
- Publication date Jan 6, 2011
- STATS ChipPAC, Ltd.
- Leo A. Merilo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HEAT SPREADER STACKING SYSTEM
- Publication number 20100224991
- Publication date Sep 9, 2010
- Dario S. Filoteo, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quad Flat Package
- Publication number 20100140761
- Publication date Jun 10, 2010
- STATS ChipPAC, Ltd.
- Emmanuel A. Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Quad Flat Package
- Publication number 20100144100
- Publication date Jun 10, 2010
- STATS ChipPAC, Ltd.
- Emmanuel A. Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE SEMICONDUCTOR DEVICE HAVING CIRCUIT TAPE
- Publication number 20100078794
- Publication date Apr 1, 2010
- Philip Lyndon R. Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH OPEN SUBSTRATE
- Publication number 20100038771
- Publication date Feb 18, 2010
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER
- Publication number 20090152704
- Publication date Jun 18, 2009
- Philip Lyndon Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP MODULE PACKAGE AND FABRICATION METHOD
- Publication number 20090014866
- Publication date Jan 15, 2009
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS

Dario S. Filoteo, JR.

Person

Patents Grantslast 30 patents

Integrated circuit package system having interconnect stack and ext...

Method of forming quad flat package

Quad flat package

Integrated circuit package with open substrate

Stacked integrated circuits package system with passive components

Direct via wire bonding and method of assembling the same

Multichip module package and fabrication method

Integrated circuit packaging system with interposer

Array-molded package heat spreader and fabrication method therefor

Stacked die semiconductor device having circuit tape

Integrated circuit heat spreader stacking method

Quad flat package

Stacked die semiconductor device having circuit tape

Integrated circuit package with open substrate

Integrated circuit package system including high-density small foot...

Integrated circuit package system including die stacking

Integrated circuit packaging system with interposer

Multichip module package and fabrication method

Integrated circuit package-in-package system

Integrated circuit package system including die stacking

Chip scale package with open substrate

Multichip module package and fabrication method

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE WITH OPEN SUBSTRATE AND METHOD OF MANUFA...

Chip Scale Module Package in BGA Semiconductor Package

INTEGRATED CIRCUIT HEAT SPREADER STACKING SYSTEM

Quad Flat Package

Method of Forming Quad Flat Package

STACKED DIE SEMICONDUCTOR DEVICE HAVING CIRCUIT TAPE

INTEGRATED CIRCUIT PACKAGE WITH OPEN SUBSTRATE

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER

MULTICHIP MODULE PACKAGE AND FABRICATION METHOD