Darrel R. Frear

Person

Phoneix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Differential pressure sensor assembly
- Patent number 9,638,597
- Issue date May 2, 2017
- NXP USA, INC.
- Stephen R. Hooper
- G01 - MEASURING TESTING
Information Patent Grant
Environmental sensor structure
- Patent number 9,598,280
- Issue date Mar 21, 2017
- NXP USA, INC.
- Akhilesh K. Singh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic devices with cavity-type, permeable material filled pack...
- Patent number 9,510,495
- Issue date Nov 29, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die-to-die inductive communication devices and methods
- Patent number 9,466,413
- Issue date Oct 11, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Fred T. Brauchler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame having a flag with in-plane and out-of-plane mold lockin...
- Patent number 8,742,555
- Issue date Jun 3, 2014
- Jian Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistributed chip packaging with thermal contact to device backside
- Patent number 8,217,511
- Issue date Jul 10, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Neil T. Tracht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an integrated circuit package with shielding via r...
- Patent number 8,097,494
- Issue date Jan 17, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated conformal shielding method and process using redistribut...
- Patent number 7,981,730
- Issue date Jul 19, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a packaged semiconductor device
- Patent number 7,838,420
- Issue date Nov 23, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit module with integrated passive device
- Patent number 7,763,976
- Issue date Jul 27, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shield formation for integrated circuit die package
- Patent number 7,651,889
- Issue date Jan 26, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component comprising leadframe, semiconductor chip an...
- Patent number 7,074,647
- Issue date Jul 11, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Norman L. Owens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method of manufacture
- Patent number 6,630,725
- Issue date Oct 7, 2003
- Motorola, Inc.
- Shun-Meen Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ENVIRONMENTAL SENSOR STRUCTURE
- Publication number 20160130136
- Publication date May 12, 2016
- Freescale Semiconductor, Inc.
- AKHILESH K. SINGH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Differential Pressure Sensor Assembly
- Publication number 20160084722
- Publication date Mar 24, 2016
- Freescale Semiconductor Inc.
- Stephen R. Hooper
- G01 - MEASURING TESTING
Information Patent Application
DIE-TO-DIE INDUCTIVE COMMUNICATION DEVICES AND METHODS
- Publication number 20150004902
- Publication date Jan 1, 2015
- John M. PIGOTT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-TO-DIE INDUCTIVE COMMUNICATION DEVICES AND METHODS
- Publication number 20150001948
- Publication date Jan 1, 2015
- Fred T. BRAUCHLER
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRONIC DEVICES WITH CAVITY-TYPE, PERMEABLE MATERIAL FILLED PACK...
- Publication number 20140146509
- Publication date May 29, 2014
- STEPHEN R. HOOPER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LEAD FRAME HAVING A FLAG WITH IN-PLANE AND OUT-OF-PLANE MOLD LOCKIN...
- Publication number 20130049181
- Publication date Feb 28, 2013
- Jian Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE
- Publication number 20120252169
- Publication date Oct 4, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Neil T. Tracht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE
- Publication number 20110003435
- Publication date Jan 6, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT MODULE WITH INTEGRATED PASSIVE DEVICE
- Publication number 20100078760
- Publication date Apr 1, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Conformal Shielding Method and Process Using Redistribut...
- Publication number 20100006988
- Publication date Jan 14, 2010
- Jinbang Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE
- Publication number 20090075428
- Publication date Mar 19, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated shielding process for precision high density module pack...
- Publication number 20090072357
- Publication date Mar 19, 2009
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT IN A MULTI-ELEMENT PACKAGE
- Publication number 20090057849
- Publication date Mar 5, 2009
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE
- Publication number 20090032933
- Publication date Feb 5, 2009
- Neil T. Tracht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component and method of manufacturing same
- Publication number 20050006730
- Publication date Jan 13, 2005
- MOTOROLA, INC.
- Norman L. Owens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS control chip integration
- Publication number 20040016995
- Publication date Jan 29, 2004
- Shun Meen Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Tailorable fiber-reinforced support structure for use in precision...
- Publication number 20020160187
- Publication date Oct 31, 2002
- Marcus John Craig
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Darrel R. Frear

Person

Patents Grantslast 30 patents

Differential pressure sensor assembly

Environmental sensor structure

Electronic devices with cavity-type, permeable material filled pack...

Die-to-die inductive communication devices and methods

Lead frame having a flag with in-plane and out-of-plane mold lockin...

Redistributed chip packaging with thermal contact to device backside

Method of making an integrated circuit package with shielding via r...

Integrated conformal shielding method and process using redistribut...

Method for forming a packaged semiconductor device

Integrated circuit module with integrated passive device

Electromagnetic shield formation for integrated circuit die package

Semiconductor component comprising leadframe, semiconductor chip an...

Electronic component and method of manufacture

Patents Applicationslast 30 patents

ENVIRONMENTAL SENSOR STRUCTURE

Differential Pressure Sensor Assembly

DIE-TO-DIE INDUCTIVE COMMUNICATION DEVICES AND METHODS

DIE-TO-DIE INDUCTIVE COMMUNICATION DEVICES AND METHODS

ELECTRONIC DEVICES WITH CAVITY-TYPE, PERMEABLE MATERIAL FILLED PACK...

LEAD FRAME HAVING A FLAG WITH IN-PLANE AND OUT-OF-PLANE MOLD LOCKIN...

REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE

ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE

INTEGRATED CIRCUIT MODULE WITH INTEGRATED PASSIVE DEVICE

Integrated Conformal Shielding Method and Process Using Redistribut...

ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE

Integrated shielding process for precision high density module pack...

INTERCONNECT IN A MULTI-ELEMENT PACKAGE

REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE

Semiconductor component and method of manufacturing same

MEMS control chip integration

Tailorable fiber-reinforced support structure for use in precision...