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Darrell Foote
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Walnut Creek, CA, US
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last 30 patents
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Patent Grant
Modified plasma dicing process to improve back metal cleaving
Patent number
10,056,297
Issue date
Aug 21, 2018
Paul C. Lindsey
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method using fluid pressure to remove back metal from semiconductor...
Patent number
8,906,745
Issue date
Dec 9, 2014
Micro Processing Technology, Inc.
Paul C. Lindsey
H01 - BASIC ELECTRIC ELEMENTS