Darren S. Jue

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
High performance interconnect
- Patent number 12,197,357
- Issue date Jan 14, 2025
- Intel Corporation
- Robert J. Safranek
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance interconnect
- Patent number 12,189,550
- Issue date Jan 7, 2025
- Intel Corporation
- Robert J. Safranek
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance interconnect
- Patent number 11,741,030
- Issue date Aug 29, 2023
- Intel Corporation
- Robert J. Safranek
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-host direct memory access system for integrated circuits
- Patent number 11,726,936
- Issue date Aug 15, 2023
- Xilinx, Inc.
- Chandrasekhar S. Thyamagondlu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance interconnect
- Patent number 11,269,793
- Issue date Mar 8, 2022
- Intel Corporation
- Robert J. Safranek
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-host direct memory access system for integrated circuits
- Patent number 11,232,053
- Issue date Jan 25, 2022
- Xilinx, Inc.
- Chandrasekhar S. Thyamagondlu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance interconnect physical layer
- Patent number 11,080,212
- Issue date Aug 3, 2021
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Customizable multi queue DMA interface
- Patent number 10,983,920
- Issue date Apr 20, 2021
- Xilinx, Inc.
- Chandrasekhar S Thyamagondlu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance interconnect physical layer
- Patent number 10,909,055
- Issue date Feb 2, 2021
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance interconnect physical layer
- Patent number 10,795,841
- Issue date Oct 6, 2020
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interrupt moderation and aggregation circuitry
- Patent number 10,657,084
- Issue date May 19, 2020
- Xilinx, Inc.
- Chandrasekhar S. Thyamagondlu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance interconnect physical layer
- Patent number 10,606,774
- Issue date Mar 31, 2020
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance interconnect physical layer
- Patent number 10,387,339
- Issue date Aug 20, 2019
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance interconnect physical layer
- Patent number 10,380,046
- Issue date Aug 13, 2019
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance interconnect
- Patent number 10,248,591
- Issue date Apr 2, 2019
- Intel Corporation
- Robert J. Safranek
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
High performance interconnect physical layer
- Patent number 10,216,674
- Issue date Feb 26, 2019
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance interconnect physical layer
- Patent number 10,216,661
- Issue date Feb 26, 2019
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance interconnect physical layer
- Patent number 10,146,733
- Issue date Dec 4, 2018
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance interconnect physical layer
- Patent number 10,002,095
- Issue date Jun 19, 2018
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance interconnect physical layer
- Patent number 9,916,266
- Issue date Mar 13, 2018
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance interconnect physical layer
- Patent number 9,892,086
- Issue date Feb 13, 2018
- Intel Corporation
- Venkatraman Iyer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
High performance interconnect physical layer
- Patent number 9,697,158
- Issue date Jul 4, 2017
- Intel Corporation
- Venkatraman Iyer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
High performance interconnect
- Patent number 9,626,321
- Issue date Apr 18, 2017
- Intel Corporation
- Robert J. Safranek
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
High performance interconnect physical layer
- Patent number 9,612,986
- Issue date Apr 4, 2017
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance interconnect physical layer
- Patent number 9,600,431
- Issue date Mar 21, 2017
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance interconnect physical layer
- Patent number 9,418,035
- Issue date Aug 16, 2016
- Intel Corporation
- Venkatraman Iyer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
High performance interconnect physical layer
- Patent number 9,378,171
- Issue date Jun 28, 2016
- Intel Corporation
- Venkatraman Iyer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
High performance interconnect physical layer
- Patent number 9,355,058
- Issue date May 31, 2016
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance interconnect physical layer
- Patent number 9,280,507
- Issue date Mar 8, 2016
- Intel Corporation
- Venkatraman Iyer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Embedded control channel for high speed serial interconnect
- Patent number 9,229,897
- Issue date Jan 5, 2016
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
FIREWALLING COMMUNICATION PORTS IN A MULTI-PORT SYSTEM
- Publication number 20240314107
- Publication date Sep 19, 2024
- Xilinx, Inc.
- Chandrasekhar S. Thyamagondlu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT
- Publication number 20240012772
- Publication date Jan 11, 2024
- Intel Corporation
- Robert J. Safranek
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT
- Publication number 20220114122
- Publication date Apr 14, 2022
- Intel Corporation
- Robert J. Safranek
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-HOST DIRECT MEMORY ACCESS SYSTEM FOR INTEGRATED CIRCUITS
- Publication number 20220092010
- Publication date Mar 24, 2022
- Xilinx, Inc.
- Chandrasekhar S. Thyamagondlu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT
- Publication number 20210117350
- Publication date Apr 22, 2021
- Intel Corporation
- Robert J. Safranek
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20200356496
- Publication date Nov 12, 2020
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT
- Publication number 20200356502
- Publication date Nov 12, 2020
- Intel Corporation
- Robert J. Safranek
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20190391945
- Publication date Dec 26, 2019
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT
- Publication number 20190391939
- Publication date Dec 26, 2019
- Intel Corporation
- Robert J. Safranek
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20190347226
- Publication date Nov 14, 2019
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CUSTOMIZABLE MULTI QUEUE DMA INTERFACE
- Publication number 20190243781
- Publication date Aug 8, 2019
- Xilinx, Inc.
- Chandrasekhar S Thyamagondlu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20180203811
- Publication date Jul 19, 2018
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20180189201
- Publication date Jul 5, 2018
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20180095927
- Publication date Apr 5, 2018
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20170116148
- Publication date Apr 27, 2017
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT
- Publication number 20170109315
- Publication date Apr 20, 2017
- Intel Corporation
- Robert J. Safranek
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20170109296
- Publication date Apr 20, 2017
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20170097907
- Publication date Apr 6, 2017
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20170083476
- Publication date Mar 23, 2017
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20160378711
- Publication date Dec 29, 2016
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20150205741
- Publication date Jul 23, 2015
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20150169486
- Publication date Jun 18, 2015
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20150067208
- Publication date Mar 5, 2015
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20150067207
- Publication date Mar 5, 2015
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20150067210
- Publication date Mar 5, 2015
- Intel Corporation
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20140215437
- Publication date Jul 31, 2014
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20140215112
- Publication date Jul 31, 2014
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20140115374
- Publication date Apr 24, 2014
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20140115207
- Publication date Apr 24, 2014
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
- Publication number 20140114887
- Publication date Apr 24, 2014
- Venkatraman Iyer
- G06 - COMPUTING CALCULATING COUNTING

Darren S. Jue

Person

Patents Grantslast 30 patents

High performance interconnect

High performance interconnect

High performance interconnect

Multi-host direct memory access system for integrated circuits

High performance interconnect

Multi-host direct memory access system for integrated circuits

High performance interconnect physical layer

Customizable multi queue DMA interface

High performance interconnect physical layer

High performance interconnect physical layer

Interrupt moderation and aggregation circuitry

High performance interconnect physical layer

High performance interconnect physical layer

High performance interconnect physical layer

High performance interconnect

High performance interconnect physical layer

High performance interconnect physical layer

High performance interconnect physical layer

High performance interconnect physical layer

High performance interconnect physical layer

High performance interconnect physical layer

High performance interconnect physical layer

High performance interconnect

High performance interconnect physical layer

High performance interconnect physical layer

High performance interconnect physical layer

High performance interconnect physical layer

High performance interconnect physical layer

High performance interconnect physical layer

Embedded control channel for high speed serial interconnect

Patents Applicationslast 30 patents

FIREWALLING COMMUNICATION PORTS IN A MULTI-PORT SYSTEM

HIGH PERFORMANCE INTERCONNECT

HIGH PERFORMANCE INTERCONNECT

MULTI-HOST DIRECT MEMORY ACCESS SYSTEM FOR INTEGRATED CIRCUITS

HIGH PERFORMANCE INTERCONNECT

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

HIGH PERFORMANCE INTERCONNECT

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

HIGH PERFORMANCE INTERCONNECT

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

CUSTOMIZABLE MULTI QUEUE DMA INTERFACE

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

HIGH PERFORMANCE INTERCONNECT

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER