Darryl D. Restaino

Person

Modena, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Metrology management
- Patent number 9,652,729
- Issue date May 16, 2017
- International Business Machines Corporation
- William K. Hoffman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Low k dielectric CVD film formation process with in-situ imbedded n...
- Patent number 7,998,880
- Issue date Aug 16, 2011
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preventing backside defects in dielectric layers formed...
- Patent number 7,910,484
- Issue date Mar 22, 2011
- International Business Machines Corporation
- Chester T. Dziobkowski
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structures with improved interfacial strength of SiCOH dielectrics...
- Patent number 7,888,741
- Issue date Feb 15, 2011
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BEOL interconnect structures with improved resistance to stress
- Patent number 7,847,402
- Issue date Dec 7, 2010
- International Business Machines Corporation
- Darryl D. Restaino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure to improve adhesion between top CVD low-K dielectric and...
- Patent number 7,820,559
- Issue date Oct 26, 2010
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded nano UV blocking and diffusion barrier for improved reliab...
- Patent number 7,749,892
- Issue date Jul 6, 2010
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming metal interconnect structures on semiconductor s...
- Patent number 7,737,029
- Issue date Jun 15, 2010
- Samsung Electronics Co., Ltd.
- Jae-hak Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimizing low-k dielectric damage during plasma processing
- Patent number 7,691,736
- Issue date Apr 6, 2010
- Infineon Technologies AG
- Michael Beck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void-free damascene copper deposition process and means of monitori...
- Patent number 7,678,258
- Issue date Mar 16, 2010
- International Business Machines Corporation
- Panayotis Andricacos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure and method for porous SiCOH dielectric layers and adhesio...
- Patent number 7,615,482
- Issue date Nov 10, 2009
- International Business Machines Corporation
- Daniel C. Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Advanced low dielectric constant organosilicon plasma chemical vapo...
- Patent number 7,494,938
- Issue date Feb 24, 2009
- International Business Machines Corporation
- Son V. Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming dual-damascene interconnect structures using adh...
- Patent number 7,459,388
- Issue date Dec 2, 2008
- Samsung Electronics Co., Ltd.
- Jaehak Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturable CoWP metal cap process for copper interconnects
- Patent number 7,407,605
- Issue date Aug 5, 2008
- International Business Machines Corporation
- Darryl D. Restaino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure to improve adhesion between top CVD low-k dielectric and...
- Patent number 7,402,532
- Issue date Jul 22, 2008
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low k dielectric CVD film formation process with in-situ imbedded n...
- Patent number 7,265,437
- Issue date Sep 4, 2007
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturable CoWP metal cap process for copper interconnects
- Patent number 7,253,106
- Issue date Aug 7, 2007
- International Business Machines Corporation
- Darryl D. Restaino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Advanced low dielectric constant organosilicon plasma chemical vapo...
- Patent number 7,202,564
- Issue date Apr 10, 2007
- International Business Machines Corporation
- Son Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure to improve adhesion between top CVD low-k dielectric and...
- Patent number 7,102,232
- Issue date Sep 5, 2006
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures with improved interfacial strength of SiCOH dielectrics...
- Patent number 7,067,437
- Issue date Jun 27, 2006
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced BEOL interconnect structures with low-k PE CVD cap layer a...
- Patent number 6,939,797
- Issue date Sep 6, 2005
- International Business Machines Corporation
- Edward Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reworking low-k polymers used in semiconductor structures
- Patent number 6,864,180
- Issue date Mar 8, 2005
- International Business Machines Corporation
- Darryl D. Restaino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for eliminating via resistance shift in organic ILD
- Patent number 6,806,182
- Issue date Oct 19, 2004
- International Business Machines Corporation
- Darryl Restaino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier layer and semiconductor device containing same
- Patent number 6,784,485
- Issue date Aug 31, 2004
- International Business Machines Corporation
- Stephan Alan Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced BEOL interconnect structures with low-k PE CVD cap layer a...
- Patent number 6,737,747
- Issue date May 18, 2004
- International Business Machines Corporation
- Edward Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated diffusion barrier
- Patent number 6,726,996
- Issue date Apr 27, 2004
- International Business Machines Corporation
- Edward Paul Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film planarization for low-k polymers used in semiconductor structures
- Patent number 6,638,878
- Issue date Oct 28, 2003
- International Business Machines Corporation
- Darryl D. Restaino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus to improve coating quality
- Patent number 6,493,078
- Issue date Dec 10, 2002
- International Business Machines Corporation
- John A. Fitzsimmons
- G01 - MEASURING TESTING
Information Patent Grant
Radio-frequency coil for use in an ionized physical vapor depositio...
- Patent number 6,238,532
- Issue date May 29, 2001
- International Business Machines Corporation
- Stephen Mark Rossnagel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer clamp ring for use in an ionized physical vapor deposition ap...
- Patent number 6,176,931
- Issue date Jan 23, 2001
- International Business Machines Corporation
- Darryl D. Restaino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Metrology Management
- Publication number 20130110448
- Publication date May 2, 2013
- International Business Machines Corporation
- William K. Hoffman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOW k DIELECTRIC CVD FILM FORMATION PROCESS WITH IN-SITU IMBEDDED N...
- Publication number 20100028695
- Publication date Feb 4, 2010
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SiCOH INTERFACES WITH INCREASED MECHANICAL...
- Publication number 20100009161
- Publication date Jan 14, 2010
- International Business Machines Corporation
- Daniel C. Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods of Forming Metal Interconnect Structures on Semiconductor S...
- Publication number 20090239374
- Publication date Sep 24, 2009
- Samsung Electroincs Co., Ltd.
- Jae hak Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREVENTING BACKSIDE DEFECTS IN DIELECTRIC LAYERS FORMED...
- Publication number 20090181544
- Publication date Jul 16, 2009
- Chester T. Dziobkowski
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STRUCTURE TO IMPROVE ADHESION BETWEEN TOP CVD LOW-K DIELECTRIC AND...
- Publication number 20080254643
- Publication date Oct 16, 2008
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SiCOH INTERFACES WITH INCREASED MECHANICAL...
- Publication number 20080233366
- Publication date Sep 25, 2008
- International Business Machines Corporation
- Daniel C. Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BEOL INTERCONNECT STRUCTURES WITH IMPROVED RESISTANCE TO STRESS
- Publication number 20080197513
- Publication date Aug 21, 2008
- International Business Machines Corporation
- Darryl D. Restaino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED NANO UV BLOCKING BARRIER FOR IMPROVED RELIABILITY OF COPPE...
- Publication number 20080122103
- Publication date May 29, 2008
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Dual-Damascene Interconnect Structures Using Adh...
- Publication number 20080057697
- Publication date Mar 6, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Jaehak Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS
- Publication number 20070215842
- Publication date Sep 20, 2007
- International Business Machines Corporation
- Darryl D. Restaino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Minimizing low-k dielectric damage during plasma processing
- Publication number 20070190804
- Publication date Aug 16, 2007
- Michael Beck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure to improve adhesion between top CVD low-k dielectric and...
- Publication number 20070148958
- Publication date Jun 28, 2007
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED LOW DIELECTRIC CONSTANT ORGANOSILICON PLASMA CHEMICAL VAPO...
- Publication number 20070128882
- Publication date Jun 7, 2007
- International Business Machines Corporation
- Son V. Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW k DIELECTRIC CVD FILM FORMATION PROCESS WITH IN-SITU IMBEDDED N...
- Publication number 20060202311
- Publication date Sep 14, 2006
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures with improved interfacial strength of SiCOH dielectrics...
- Publication number 20060189153
- Publication date Aug 24, 2006
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED LOW DIELECTRIC CONSTANT ORGANOSILICON PLASMA CHEMICAL VAPO...
- Publication number 20060183345
- Publication date Aug 17, 2006
- International Business Machines Corporation
- Son Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS
- Publication number 20060134911
- Publication date Jun 22, 2006
- Darryl D. Restaino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Structure to improve adhesion between top CVD low-k dielectiric and...
- Publication number 20050230831
- Publication date Oct 20, 2005
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for removing impurities from low dielectric constant films...
- Publication number 20050087490
- Publication date Apr 28, 2005
- International Business Machines Corporation
- Mark S. Chace
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Structures with improved interfacial strength of SiCOH dielectrics...
- Publication number 20050059258
- Publication date Mar 17, 2005
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Void-free damascene copper deposition process and means of monitori...
- Publication number 20050006242
- Publication date Jan 13, 2005
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Advanced BEOL interconnect structures with low-k PE CVD cap layer a...
- Publication number 20040173908
- Publication date Sep 9, 2004
- Edward Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming planar Cu interconnects without chemical mechanic...
- Publication number 20040094511
- Publication date May 20, 2004
- International Business Machines Corporation
- Soon-Cheon Seo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for eliminating VIA resistance shift in organic ILD
- Publication number 20030207559
- Publication date Nov 6, 2003
- International Business Machines Corporation
- Darryl Restaino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced BEOL interconnect structures with low-k PE CVD cap layer a...
- Publication number 20030132510
- Publication date Jul 17, 2003
- International Business Machines Corporation
- Edward Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for reworking low-K polymers used in semiconductor structures
- Publication number 20030062336
- Publication date Apr 3, 2003
- International Business Machines Corporation
- Darryl D. Restaino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Film planarization for low-k polymers used in semiconductor structures
- Publication number 20030064605
- Publication date Apr 3, 2003
- International Business Machines Corporation
- Darryl D. Restaino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminated diffusion barrier
- Publication number 20020172811
- Publication date Nov 21, 2002
- International Business Machines Corporation
- Edward Paul Barth
- B32 - LAYERED PRODUCTS
Information Patent Application
Metal deposition process for metal lines over topography
- Publication number 20020017726
- Publication date Feb 14, 2002
- Parth P. Dave
- H01 - BASIC ELECTRIC ELEMENTS

Darryl D. Restaino

Person

Patents Grantslast 30 patents

Metrology management

Low k dielectric CVD film formation process with in-situ imbedded n...

Method for preventing backside defects in dielectric layers formed...

Structures with improved interfacial strength of SiCOH dielectrics...

BEOL interconnect structures with improved resistance to stress

Structure to improve adhesion between top CVD low-K dielectric and...

Embedded nano UV blocking and diffusion barrier for improved reliab...

Methods of forming metal interconnect structures on semiconductor s...

Minimizing low-k dielectric damage during plasma processing

Void-free damascene copper deposition process and means of monitori...

Structure and method for porous SiCOH dielectric layers and adhesio...

Advanced low dielectric constant organosilicon plasma chemical vapo...

Methods of forming dual-damascene interconnect structures using adh...

Manufacturable CoWP metal cap process for copper interconnects

Structure to improve adhesion between top CVD low-k dielectric and...

Low k dielectric CVD film formation process with in-situ imbedded n...

Manufacturable CoWP metal cap process for copper interconnects

Advanced low dielectric constant organosilicon plasma chemical vapo...

Structure to improve adhesion between top CVD low-k dielectric and...

Structures with improved interfacial strength of SiCOH dielectrics...

Advanced BEOL interconnect structures with low-k PE CVD cap layer a...

Method for reworking low-k polymers used in semiconductor structures

Method for eliminating via resistance shift in organic ILD

Diffusion barrier layer and semiconductor device containing same

Advanced BEOL interconnect structures with low-k PE CVD cap layer a...

Laminated diffusion barrier

Film planarization for low-k polymers used in semiconductor structures

Method and apparatus to improve coating quality

Radio-frequency coil for use in an ionized physical vapor depositio...

Wafer clamp ring for use in an ionized physical vapor deposition ap...

Patents Applicationslast 30 patents

Metrology Management

LOW k DIELECTRIC CVD FILM FORMATION PROCESS WITH IN-SITU IMBEDDED N...

STRUCTURE AND METHOD FOR SiCOH INTERFACES WITH INCREASED MECHANICAL...

Methods of Forming Metal Interconnect Structures on Semiconductor S...

METHOD FOR PREVENTING BACKSIDE DEFECTS IN DIELECTRIC LAYERS FORMED...

STRUCTURE TO IMPROVE ADHESION BETWEEN TOP CVD LOW-K DIELECTRIC AND...

STRUCTURE AND METHOD FOR SiCOH INTERFACES WITH INCREASED MECHANICAL...

BEOL INTERCONNECT STRUCTURES WITH IMPROVED RESISTANCE TO STRESS

EMBEDDED NANO UV BLOCKING BARRIER FOR IMPROVED RELIABILITY OF COPPE...

Methods of Forming Dual-Damascene Interconnect Structures Using Adh...

MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS

Minimizing low-k dielectric damage during plasma processing

Structure to improve adhesion between top CVD low-k dielectric and...

ADVANCED LOW DIELECTRIC CONSTANT ORGANOSILICON PLASMA CHEMICAL VAPO...

LOW k DIELECTRIC CVD FILM FORMATION PROCESS WITH IN-SITU IMBEDDED N...

Structures with improved interfacial strength of SiCOH dielectrics...

ADVANCED LOW DIELECTRIC CONSTANT ORGANOSILICON PLASMA CHEMICAL VAPO...

MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS

Structure to improve adhesion between top CVD low-k dielectiric and...

Process for removing impurities from low dielectric constant films...

Structures with improved interfacial strength of SiCOH dielectrics...

Void-free damascene copper deposition process and means of monitori...

Advanced BEOL interconnect structures with low-k PE CVD cap layer a...

Method of forming planar Cu interconnects without chemical mechanic...

Method for eliminating VIA resistance shift in organic ILD

Advanced BEOL interconnect structures with low-k PE CVD cap layer a...

Method for reworking low-K polymers used in semiconductor structures

Film planarization for low-k polymers used in semiconductor structures

Laminated diffusion barrier

Metal deposition process for metal lines over topography