Darryl J. MCKENNEY

Person

Londonderry, NH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Soldered interconnect for a printed circuit board having an angular...
- Patent number 10,096,915
- Issue date Oct 9, 2018
- MERCURY SYSTEMS, INC.
- Darryl J. McKenney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency connector and assembly having micro-via radial inte...
- Patent number 9,761,972
- Issue date Sep 12, 2017
- MERCURY SYSTEMS, INC.
- Philip Beucler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-flow-by cooling technology and air-flow-by circuit board modules
- Patent number 9,389,654
- Issue date Jul 12, 2016
- MERCURY SYSTEMS, INC.
- Darryl J. McKenney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slot and memory module for a slot standing interconnect
- Patent number 9,128,679
- Issue date Sep 8, 2015
- Mercury Computer Systems, Inc.
- Darryl J. McKenney
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical contact
- Patent number 9,033,750
- Issue date May 19, 2015
- Tyco Electronics Corporation
- Keith Edwin Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled impedance extruded flat ribbon cable
- Patent number 6,689,958
- Issue date Feb 10, 2004
- Parlex Corporation
- Darryl J. McKenney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for providing bond enhancement and an etch resist in the fa...
- Patent number 6,645,549
- Issue date Nov 11, 2003
- Parlex Corporation
- Darryl J. McKenney
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Rigid/flex printed circuit board and manufacturing method therefor
- Patent number 6,099,745
- Issue date Aug 8, 2000
- Parlex Corporation
- Darryl McKenney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a circuit board or layer thereof including semi-cu...
- Patent number 5,557,843
- Issue date Sep 24, 1996
- Parlex Corporation
- Darryl J. McKenney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed circuit board
- Patent number 5,376,232
- Issue date Dec 27, 1994
- Parlex Corporation
- Darryl J. McKenney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple layer printed circuit boards and method of manufacture
- Patent number 5,362,534
- Issue date Nov 8, 1994
- Parlex Corporation
- Darryl J. McKenney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer rigid-flex printed circuit boards for use in infrared re...
- Patent number 5,262,594
- Issue date Nov 16, 1993
- Compaq Computer Corporation
- Eric R. Edwin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer rigid-flex printed circuit boards for use in infrared re...
- Patent number 5,178,318
- Issue date Jan 12, 1993
- Compaq Computer Corp.
- Eric R. Edwin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid-flex printed circuit
- Patent number 5,175,047
- Issue date Dec 29, 1992
- Teledyne Industries, Inc.
- Darryl J. McKenney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of forming a rigid-flex circuit
- Patent number 5,095,628
- Issue date Mar 17, 1992
- Teledyne Industries, Inc.
- Darryl J. McKenney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer combined rigid and flex printed circuits
- Patent number 4,800,461
- Issue date Jan 24, 1989
- Teledyne Industries, Inc.
- Herbert S. Dixon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDERED INTERCONNECT FOR A PRINTED CIRCUIT BOARD HAVING AN ANGULAR...
- Publication number 20170244184
- Publication date Aug 24, 2017
- MERCURY SYSTEMS, INC.
- Darryl J. MCKENNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY CONNECTOR AND ASSEMBLY HAVING MICRO-VIA RADIAL INTE...
- Publication number 20170149156
- Publication date May 25, 2017
- MERCURY SYSTEMS, INC.
- Philip BEUCLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERED INTERCONNECT FOR A PRINTED CIRCUIT BOARD HAVING AN ANGULAR...
- Publication number 20170149155
- Publication date May 25, 2017
- MERCURY SYSTEMS, INC.
- Darryl J. MCKENNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERED INTERCONNECT FOR A PRINTED CIRCUIT BOARD HAVING AN ANGULAR...
- Publication number 20170149154
- Publication date May 25, 2017
- MERCURY SYSTEMS, INC.
- Darryl J. MCKENNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-FLOW-BY COOLING TECHNOLOGY AND AIR-FLOW-BY CIRCUIT BOARD MODULES
- Publication number 20140160670
- Publication date Jun 12, 2014
- MERCURY COMPUTER SYSTEMS, INC.
- Darryl J. McKenney
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICAL CONTACT
- Publication number 20140051294
- Publication date Feb 20, 2014
- MERCURY SYSTEMS, INC.
- Keith Edwin Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOT AND MEMORY MODULE FOR A SLOT STANDING INTERCONNECT
- Publication number 20130058050
- Publication date Mar 7, 2013
- MERCURY COMPUTER SYSTEMS, INC.
- Darryl J. MCKENNEY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Rugged Chip Packaging
- Publication number 20080280463
- Publication date Nov 13, 2008
- MERCURY COMPUTER SYSTEMS, INC.
- Darryl J. McKenney
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Manufacture of flexible printed circuit boards
- Publication number 20040040148
- Publication date Mar 4, 2004
- Parlex Corporation
- Arthur DeMaso
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROLLED IMPEDANCE EXTRUDED FLAT RIBBON CABLE
- Publication number 20040011552
- Publication date Jan 22, 2004
- Parlex Corporation
- Darryl J. McKenney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Extruded flat cable
- Publication number 20040011553
- Publication date Jan 22, 2004
- Parlex Corporation
- David Cianciolo
- H01 - BASIC ELECTRIC ELEMENTS

Darryl J. MCKENNEY

Person

Patents Grantslast 30 patents

Soldered interconnect for a printed circuit board having an angular...

Radio frequency connector and assembly having micro-via radial inte...

Air-flow-by cooling technology and air-flow-by circuit board modules

Slot and memory module for a slot standing interconnect

Electrical contact

Controlled impedance extruded flat ribbon cable

Process for providing bond enhancement and an etch resist in the fa...

Rigid/flex printed circuit board and manufacturing method therefor

Method of making a circuit board or layer thereof including semi-cu...

Method of manufacturing a printed circuit board

Multiple layer printed circuit boards and method of manufacture

Multilayer rigid-flex printed circuit boards for use in infrared re...

Multilayer rigid-flex printed circuit boards for use in infrared re...

Rigid-flex printed circuit

Process of forming a rigid-flex circuit

Multilayer combined rigid and flex printed circuits

Patents Applicationslast 30 patents

SOLDERED INTERCONNECT FOR A PRINTED CIRCUIT BOARD HAVING AN ANGULAR...

RADIO FREQUENCY CONNECTOR AND ASSEMBLY HAVING MICRO-VIA RADIAL INTE...

SOLDERED INTERCONNECT FOR A PRINTED CIRCUIT BOARD HAVING AN ANGULAR...

SOLDERED INTERCONNECT FOR A PRINTED CIRCUIT BOARD HAVING AN ANGULAR...

AIR-FLOW-BY COOLING TECHNOLOGY AND AIR-FLOW-BY CIRCUIT BOARD MODULES

ELECTRICAL CONTACT

SLOT AND MEMORY MODULE FOR A SLOT STANDING INTERCONNECT

Rugged Chip Packaging

Manufacture of flexible printed circuit boards

CONTROLLED IMPEDANCE EXTRUDED FLAT RIBBON CABLE

Extruded flat cable