Darryl KUO

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor component having through-silicon vias
- Patent number 11,545,392
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor component having through-silicon vias
- Patent number 10,784,162
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having through-silicon vias and method of m...
- Patent number 10,115,634
- Issue date Oct 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having through-silicon vias and method of m...
- Patent number 9,418,923
- Issue date Aug 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon vias for semicondcutor substrate and method of manu...
- Patent number 8,575,725
- Issue date Nov 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon vias for semicondcutor substrate and method of manu...
- Patent number 8,487,410
- Issue date Jul 16, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR COMPONENT HAVING THROUGH-SILICON VIAS
- Publication number 20210005515
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR COMPONENT HAVING THROUGH-SILICON VIAS
- Publication number 20190067107
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT HAVING THROUGH-SILICON VIAS AND METHOD OF M...
- Publication number 20160329245
- Publication date Nov 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT HAVING THROUGH-SILICON VIAS AND METHOD OF M...
- Publication number 20140015146
- Publication date Jan 16, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIAS FOR SEMICONDCUTOR SUBSTRATE AND METHOD OF MANU...
- Publication number 20130193578
- Publication date Aug 1, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIAS FOR SEMICONDCUTOR SUBSTRATE AND METHOD OF MANU...
- Publication number 20120261827
- Publication date Oct 18, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor component having through-silicon vias

Method of making a semiconductor component having through-silicon vias

Semiconductor component having through-silicon vias and method of m...

Semiconductor component having through-silicon vias and method of m...

Through-silicon vias for semicondcutor substrate and method of manu...

Through-silicon vias for semicondcutor substrate and method of manu...

Patents Applicationslast 30 patents

SEMICONDUCTOR COMPONENT HAVING THROUGH-SILICON VIAS

METHOD OF MAKING A SEMICONDUCTOR COMPONENT HAVING THROUGH-SILICON VIAS

SEMICONDUCTOR COMPONENT HAVING THROUGH-SILICON VIAS AND METHOD OF M...

SEMICONDUCTOR COMPONENT HAVING THROUGH-SILICON VIAS AND METHOD OF M...

THROUGH-SILICON VIAS FOR SEMICONDCUTOR SUBSTRATE AND METHOD OF MANU...

THROUGH-SILICON VIAS FOR SEMICONDCUTOR SUBSTRATE AND METHOD OF MANU...