Daryl R. Heussner

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Allen, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Spot-solderable leads for semiconductor device packages
- Patent number 11,430,719
- Issue date Aug 30, 2022
- Texas Instruments Incorporated
- Manu A. Prakuzhy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spot-solderable leads for semiconductor device packages
- Patent number 10,607,927
- Issue date Mar 31, 2020
- Texas Instruments Incorporated
- Manu J. Prakuzhy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Spot-Solderable Leads for Semiconductor Device Packages
- Publication number 20190318983
- Publication date Oct 17, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Manu A. Prakuzhy
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Spot-Solderable Leads for Semiconductor Device Packages
- Publication number 20180076116
- Publication date Mar 15, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Manu J. Prakuzhy
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER