Dave Charles Stepniak

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Phoenix, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Electroless Ni/Pd/Au metallization structure for copper interconnec...
- Patent number 6,445,069
- Issue date Sep 3, 2002
- Flip Chip Technologies, L.L.C.
- Jamin Ling
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLESS NI/PD/AU METALLIZATION STRUCTURE FOR COPPER INTERCONNEC...
- Publication number 20020096765
- Publication date Jul 25, 2002
- Jamin Ling
- H01 - BASIC ELECTRIC ELEMENTS