Dave Emory

Person

Aloha, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Patent number 10,037,956
- Issue date Jul 31, 2018
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Patent number 8,952,550
- Issue date Feb 10, 2015
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Patent number 7,250,678
- Issue date Jul 31, 2007
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Patent number 7,196,001
- Issue date Mar 27, 2007
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Patent number 6,853,076
- Issue date Feb 8, 2005
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent f...
- Patent number 6,740,427
- Issue date May 25, 2004
- Intel Corporation
- Madhav Datta
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
COPPER-CONTAINING C4 BALL-LIMITING METALLURGY STACK FOR ENHANCED RE...
- Publication number 20170141062
- Publication date May 18, 2017
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-CONTAINING C4 BALL-LIMITING METALLURGY STACK FOR ENHANCED RE...
- Publication number 20150132940
- Publication date May 14, 2015
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Publication number 20100117229
- Publication date May 13, 2010
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Publication number 20060148233
- Publication date Jul 6, 2006
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Publication number 20040159947
- Publication date Aug 19, 2004
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Publication number 20040159944
- Publication date Aug 19, 2004
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Publication number 20030057551
- Publication date Mar 27, 2003
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent f...
- Publication number 20030059644
- Publication date Mar 27, 2003
- Intel Corporation
- Madhav Datta
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Dual-stack, ball-limiting metallurgy and method of making same
- Publication number 20030060041
- Publication date Mar 27, 2003
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Thermo-mechanically robust C4 ball-limiting metallurgy to prevent f...

Patents Applicationslast 30 patents

COPPER-CONTAINING C4 BALL-LIMITING METALLURGY STACK FOR ENHANCED RE...

COPPER-CONTAINING C4 BALL-LIMITING METALLURGY STACK FOR ENHANCED RE...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Thermo-mechanically robust C4 ball-limiting metallurgy to prevent f...

Dual-stack, ball-limiting metallurgy and method of making same