Dave S. Mahadevan

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Mesa, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming a semiconductor package and structure thereof
- Patent number 7,030,469
- Issue date Apr 18, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Dave S. Mahadevan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with flag support structure
- Patent number 7,012,324
- Issue date Mar 14, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Gary G. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro electro-mechanical system sensor with selective encapsulation...
- Patent number 6,401,545
- Issue date Jun 11, 2002
- Motorola, Inc.
- David J. Monk
- G01 - MEASURING TESTING
Information Patent Grant
Package for electrical components having a molded structure with a...
- Patent number 5,686,698
- Issue date Nov 11, 1997
- Motorola, Inc.
- Dave S. Mahadevan
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Method of forming a semiconductor package and structure thereof
- Publication number 20050067676
- Publication date Mar 31, 2005
- Dave S. Mahadevan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame with flag support structure
- Publication number 20050056920
- Publication date Mar 17, 2005
- Gary G. Li
- H01 - BASIC ELECTRIC ELEMENTS