David A. Decrosta

Person

Melbourne, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Active area bonding compatible high current structures
- Patent number 8,946,912
- Issue date Feb 3, 2015
- Intersil Americas LLC
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active area bonding compatible high current structures
- Patent number 8,652,960
- Issue date Feb 18, 2014
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active area bonding compatible high current structures
- Patent number 8,569,896
- Issue date Oct 29, 2013
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active area bonding compatible high current structures
- Patent number 8,274,160
- Issue date Sep 25, 2012
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active area bonding compatible high current structures
- Patent number 7,795,130
- Issue date Sep 14, 2010
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active area bonding compatible high current structures
- Patent number 7,224,074
- Issue date May 29, 2007
- Intersil Americas Inc.
- John T Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced plasma etch process
- Patent number 7,181,306
- Issue date Feb 20, 2007
- Intersil Americas, Inc.
- David A. DeCrosta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active area bonding compatible high current structures
- Patent number 7,005,369
- Issue date Feb 28, 2006
- Intersil American Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation hardened dielectric for EEPROM
- Patent number 6,130,172
- Issue date Oct 10, 2000
- Intersil Corporation
- Robert T. Fuller
- G11 - INFORMATION STORAGE
Information Patent Grant
Planarization method by use of particle dispersion and subsequent t...
- Patent number 5,837,603
- Issue date Nov 17, 1998
- Harris Corporation
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation hardened dielectric for EEPROM
- Patent number 5,808,353
- Issue date Sep 15, 1998
- Harris Corporation
- Robert T. Fuller
- G11 - INFORMATION STORAGE
Information Patent Grant
Gas phase chemical reduction of metallic branding layer of electron...
- Patent number 5,279,850
- Issue date Jan 18, 1994
- Harris Corporation
- David A. DeCrosta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES
- Publication number 20140113444
- Publication date Apr 24, 2014
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES
- Publication number 20130130445
- Publication date May 23, 2013
- INTERSIL AMERICAS INC.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES
- Publication number 20120261836
- Publication date Oct 18, 2012
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES
- Publication number 20100261344
- Publication date Oct 14, 2010
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES
- Publication number 20070187837
- Publication date Aug 16, 2007
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES
- Publication number 20070184645
- Publication date Aug 9, 2007
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Active area bonding compatible high current structures
- Publication number 20060099823
- Publication date May 11, 2006
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced plasma etch process
- Publication number 20050236108
- Publication date Oct 27, 2005
- INTERSIL AMERICAS INC.
- David A. DeCrosta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Active area bonding compatible high current structures
- Publication number 20050042853
- Publication date Feb 24, 2005
- INTERSIL AMERICAS INC.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS

David A. Decrosta

Person

Patents Grantslast 30 patents

Active area bonding compatible high current structures

Active area bonding compatible high current structures

Active area bonding compatible high current structures

Active area bonding compatible high current structures

Active area bonding compatible high current structures

Active area bonding compatible high current structures

Enhanced plasma etch process

Active area bonding compatible high current structures

Radiation hardened dielectric for EEPROM

Planarization method by use of particle dispersion and subsequent t...

Radiation hardened dielectric for EEPROM

Gas phase chemical reduction of metallic branding layer of electron...

Patents Applicationslast 30 patents

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

Active area bonding compatible high current structures

Enhanced plasma etch process

Active area bonding compatible high current structures