David A. Howell

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Boise, ID, US

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Patents Grantslast 30 patents

Information Patent Grant
Molded selective solder pallet
- Patent number 6,247,632
- Issue date Jun 19, 2001
- MCMS Inc.
- David A. Howell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molded selective solder pallet
- Patent number 6,142,357
- Issue date Nov 7, 2000
- MCMS, Inc.
- David A. Howell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow soldering apparatus
- Patent number 6,131,793
- Issue date Oct 17, 2000
- MCMS, Inc.
- David A. Howell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow soldering method
- Patent number 6,010,061
- Issue date Jan 4, 2000
- Micron Custom Manufacturing Services Inc.
- David A. Howell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor pick-and-place machine calibration apparatus
- Patent number 5,247,844
- Issue date Sep 28, 1993
- Micron Technology, Inc.
- David A. Howell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor pick-and-place machine automatic calibration apparatus
- Patent number 5,237,622
- Issue date Aug 17, 1993
- Micron Technology, Inc.
- David A. Howell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR