David A. Laudick

Person

Kokomo, IN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of producing an overmolded electronic module with a flexible...
- Patent number 7,739,791
- Issue date Jun 22, 2010
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of overmolding an electronic assembly having an insert-molde...
- Patent number 7,603,770
- Issue date Oct 20, 2009
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making an electronic assembly
- Patent number 7,510,108
- Issue date Mar 31, 2009
- Delphi Technologies, Inc.
- Daniel A. Lawlyes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for manufacturing an overmolded electronic assembly
- Patent number 7,473,585
- Issue date Jan 6, 2009
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technique for manufacturing an overmolded electronic assembly
- Patent number 7,268,429
- Issue date Sep 11, 2007
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Overmolded electronic assembly with insert molded heat sinks
- Patent number 7,230,829
- Issue date Jun 12, 2007
- Delphi Technologies, Inc.
- Larry M Mandel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technique for connector to printed circuit board decoupling to elim...
- Patent number 6,905,349
- Issue date Jun 14, 2005
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer applied thermally conductive interposer
- Patent number 6,875,636
- Issue date Apr 5, 2005
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Compliant pin strip with integrated dam bar
- Publication number 20100032183
- Publication date Feb 11, 2010
- Scott D. Brandenburg
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of overmolding an electronic assembly having an insert-molde...
- Publication number 20090085248
- Publication date Apr 2, 2009
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sealed electronic component
- Publication number 20080053700
- Publication date Mar 6, 2008
- Kurt F. O'Connor
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making an electronic assembly
- Publication number 20070023488
- Publication date Feb 1, 2007
- DELPHI TECHNOLOGIES, INC.
- Daniel A. Lawlyes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for manufacturing an overmolded electronic assembly
- Publication number 20060292751
- Publication date Dec 28, 2006
- Scott D. Brandenburg
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Technique for manufacturing an overmolded electronic assembly
- Publication number 20060281230
- Publication date Dec 14, 2006
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Overmolded electronic assembly with insert molded heat sinks
- Publication number 20060171120
- Publication date Aug 3, 2006
- Larry M. Mandel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DAL spinner
- Publication number 20060083869
- Publication date Apr 20, 2006
- David A. Laudick
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Wafer applied thermally conductive interposer
- Publication number 20050014312
- Publication date Jan 20, 2005
- Scott D. Brandenburg
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Filtered electrical connector assembly for an overmolded electronic...
- Publication number 20040132322
- Publication date Jul 8, 2004
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

David A. Laudick

Person

Patents Grantslast 30 patents

Method of producing an overmolded electronic module with a flexible...

Method of overmolding an electronic assembly having an insert-molde...

Method of making an electronic assembly

Technique for manufacturing an overmolded electronic assembly

Technique for manufacturing an overmolded electronic assembly

Overmolded electronic assembly with insert molded heat sinks

Technique for connector to printed circuit board decoupling to elim...

Wafer applied thermally conductive interposer

Patents Applicationslast 30 patents

Compliant pin strip with integrated dam bar

Method of overmolding an electronic assembly having an insert-molde...

Sealed electronic component

Method of making an electronic assembly

Technique for manufacturing an overmolded electronic assembly

Technique for manufacturing an overmolded electronic assembly

Overmolded electronic assembly with insert molded heat sinks

DAL spinner

Wafer applied thermally conductive interposer

Filtered electrical connector assembly for an overmolded electronic...