David A. Sowatzke

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Spring Valley, WI, US

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Patents Grantslast 30 patents

Information Patent Grant
Plated polymeric article including tin/copper tie/seed layer
- Patent number 11,066,753
- Issue date Jul 20, 2021
- 3M Innovative Properties Company
- Larry S. Hebert
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
Plated Polymeric Article Including Tin/Copper Tie/Seed Layer
- Publication number 20210310145
- Publication date Oct 7, 2021
- 3M Innovative Properties Company
- Larry S. Hebert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATED POLYMERIC ARTICLE INCLUDING TIN/COPPER TIE/SEED LAYER
- Publication number 20180187323
- Publication date Jul 5, 2018
- Larry S. Hebert
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR