David Amos

Person

South Yorkshire, GB

People

Patents Grantslast 30 patents

Information Patent Grant
Cold plate and system for cooling electronic devices
- Patent number 12,096,595
- Issue date Sep 17, 2024
- ICEOTOPE GROUP LIMITED
- Alexander Cushen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink, heat sink arrangement and module for liquid immersion co...
- Patent number 11,968,802
- Issue date Apr 23, 2024
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling system for electronic modules
- Patent number 11,963,338
- Issue date Apr 16, 2024
- ICEOTOPE GROUP LIMITED
- Neil Edmunds
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink for liquid cooling
- Patent number 11,917,796
- Issue date Feb 27, 2024
- Iceotope Group Limited
- Nathan Longhurst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid cooling system
- Patent number 11,778,790
- Issue date Oct 3, 2023
- ICEOTOPE GROUP LIMITED
- Neil Edmunds
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid cooling system
- Patent number 11,737,247
- Issue date Aug 22, 2023
- ICEOTOPE GROUP LIMITED
- Neil Edmunds
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, heat sink arrangement and module for liquid immersion co...
- Patent number 11,653,472
- Issue date May 16, 2023
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, heat sink arrangement and module for liquid immersion co...
- Patent number 11,596,082
- Issue date Feb 28, 2023
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling system for electronic modules
- Patent number 11,490,546
- Issue date Nov 1, 2022
- ICEOTOPE GROUP LIMITED
- Neil Edmunds
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink, heat sink arrangement and module for liquid immersion co...
- Patent number 11,470,739
- Issue date Oct 11, 2022
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, heat sink arrangement and module for liquid immersion co...
- Patent number 11,369,040
- Issue date Jun 21, 2022
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, heat sink arrangement and module for liquid immersion co...
- Patent number 11,096,313
- Issue date Aug 17, 2021
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid cooling system
- Patent number 11,071,238
- Issue date Jul 20, 2021
- ICEOTOPE GROUP LIMITED
- Neil Edmunds
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT SINK FOR LIQUID COOLING
- Publication number 20240196572
- Publication date Jun 13, 2024
- ICEOTOPE GROUP LIMITED
- Nathan Longhurst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC COOLANT DISTRIBUTION MANIFOLD
- Publication number 20240098944
- Publication date Mar 21, 2024
- ICEOTOPE GROUP LIMITED
- Neil EDMUNDS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR COOLING ELECTRONIC DEVICES IN AN ELECTRONIC MODULE
- Publication number 20240032243
- Publication date Jan 25, 2024
- ICEOTOPE GROUP LIMITED
- Jason MATTESON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...
- Publication number 20230240042
- Publication date Jul 27, 2023
- ICEOTOPE GROUP LIMITED
- David Amos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...
- Publication number 20230217629
- Publication date Jul 6, 2023
- ICEOTOPE GROUP LIMITED
- David Amos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEM FOR ELECTRONIC MODULES
- Publication number 20230096875
- Publication date Mar 30, 2023
- ICEOTOPE GROUP LIMITED
- Neil Edmunds
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HOUSING FOR IMMERSIVE LIQUID COOLING OF MULTIPLE ELECTRONIC DEVICES
- Publication number 20230083799
- Publication date Mar 16, 2023
- ICEOTOPE GROUP LIMITED
- Andrew SHAW
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COLD PLATE AND SYSTEM FOR COOLING ELECTRONIC DEVICES
- Publication number 20220418156
- Publication date Dec 29, 2022
- ICEOTOPE GROUP LIMITED
- Alexander Cushen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...
- Publication number 20220418153
- Publication date Dec 29, 2022
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK FOR LIQUID COOLING
- Publication number 20220408609
- Publication date Dec 22, 2022
- ICEOTOPE GROUP LIMITED
- Nathan Longhurst
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NOZZLE ARRANGEMENT AND COOLING MODULE
- Publication number 20220400579
- Publication date Dec 15, 2022
- ICEOTOPE GROUP LIMITED
- Nathan Longhurst
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...
- Publication number 20220256734
- Publication date Aug 11, 2022
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID COOLING SYSTEM
- Publication number 20220217874
- Publication date Jul 7, 2022
- ICEOTOPE GROUP LIMITED
- Neil Edmunds
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SYSTEM FOR ELECTRONIC MODULES
- Publication number 20220201896
- Publication date Jun 23, 2022
- ICEOTOPE GROUP LIMITED
- Neil Edmunds
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEM FOR ELECTRONIC MODULES
- Publication number 20220110225
- Publication date Apr 7, 2022
- ICEOTOPE GROUP LIMITED
- Neil Edmunds
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...
- Publication number 20210321534
- Publication date Oct 14, 2021
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...
- Publication number 20210321535
- Publication date Oct 14, 2021
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID COOLING SYSTEM
- Publication number 20210321542
- Publication date Oct 14, 2021
- ICEOTOPE GROUP LIMITED
- Neil Edmunds
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID COOLING SYSTEM
- Publication number 20200390007
- Publication date Dec 10, 2020
- Neil Edmunds
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...
- Publication number 20200305307
- Publication date Sep 24, 2020
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AN IMMERSION COOLING SYSTEM
- Publication number 20180288906
- Publication date Oct 4, 2018
- ICEOTOPE LIMITED
- Peter Hopton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Cold plate and system for cooling electronic devices

Heat sink, heat sink arrangement and module for liquid immersion co...

Cooling system for electronic modules

Heat sink for liquid cooling

Fluid cooling system

Fluid cooling system

Heat sink, heat sink arrangement and module for liquid immersion co...

Heat sink, heat sink arrangement and module for liquid immersion co...

Cooling system for electronic modules

Heat sink, heat sink arrangement and module for liquid immersion co...

Heat sink, heat sink arrangement and module for liquid immersion co...

Heat sink, heat sink arrangement and module for liquid immersion co...

Fluid cooling system

Patents Applicationslast 30 patents

HEAT SINK FOR LIQUID COOLING

DIELECTRIC COOLANT DISTRIBUTION MANIFOLD

SYSTEM FOR COOLING ELECTRONIC DEVICES IN AN ELECTRONIC MODULE

HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...

HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...

COOLING SYSTEM FOR ELECTRONIC MODULES

HOUSING FOR IMMERSIVE LIQUID COOLING OF MULTIPLE ELECTRONIC DEVICES

COLD PLATE AND SYSTEM FOR COOLING ELECTRONIC DEVICES

HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...

HEAT SINK FOR LIQUID COOLING

NOZZLE ARRANGEMENT AND COOLING MODULE

HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...

FLUID COOLING SYSTEM

COOLING SYSTEM FOR ELECTRONIC MODULES

COOLING SYSTEM FOR ELECTRONIC MODULES

HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...

HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...

FLUID COOLING SYSTEM

FLUID COOLING SYSTEM

HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION CO...

AN IMMERSION COOLING SYSTEM