David B. Clegg

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multiple interconnections between die
- Patent number 10,037,970
- Issue date Jul 31, 2018
- NXP USA, INC.
- David Clegg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package to board interconnect structure with built-in reference pla...
- Patent number 9,974,174
- Issue date May 15, 2018
- NXP USA, INC.
- Robert Wenzel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond pad having a trench and method for forming
- Patent number 9,515,034
- Issue date Dec 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Sohrab Safai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond pad and passivation layer having a gap and method for forming
- Patent number 9,111,755
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device including interconnect barri...
- Patent number 6,713,381
- Issue date Mar 30, 2004
- Motorola, Inc.
- Alexander L. Barr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for multiplexed joining of solder bumps to various substrate...
- Patent number 6,117,759
- Issue date Sep 12, 2000
- Motorola Inc.
- Stuart E. Greer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE TO BOARD INTERCONNECT STRUCTURE WITH BUILT-IN REFERENCE PLA...
- Publication number 20180116050
- Publication date Apr 26, 2018
- FREESCALE SEMICONDUCTOR, INC.
- Robert WENZEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTIPLE INTERCONNECTIONS BETWEEN DIE
- Publication number 20180068980
- Publication date Mar 8, 2018
- FREESCALE SEMICONDUCTOR, INC.
- David Clegg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD HAVING A TRENCH AND METHOD FOR FORMING
- Publication number 20150194396
- Publication date Jul 9, 2015
- Sohrab Safai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD HAVING A TRENCH AND METHOD FOR FORMING
- Publication number 20150194395
- Publication date Jul 9, 2015
- Sohrab Safai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of formation
- Publication number 20020093098
- Publication date Jul 18, 2002
- Alexander L. Barr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for connecting a semiconductor die to a substrate and met...
- Publication number 20020079595
- Publication date Jun 27, 2002
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CONDUCTIVE BUMP AND INTERCONNECT BARRIER
- Publication number 20020000665
- Publication date Jan 3, 2002
- ALEXANDER L. BARR
- H01 - BASIC ELECTRIC ELEMENTS

David B. Clegg

Person

Patents Grantslast 30 patents

Multiple interconnections between die

Package to board interconnect structure with built-in reference pla...

Bond pad having a trench and method for forming

Bond pad and passivation layer having a gap and method for forming

Method of forming semiconductor device including interconnect barri...

Method for multiplexed joining of solder bumps to various substrate...

Patents Applicationslast 30 patents

PACKAGE TO BOARD INTERCONNECT STRUCTURE WITH BUILT-IN REFERENCE PLA...

MULTIPLE INTERCONNECTIONS BETWEEN DIE

BOND PAD HAVING A TRENCH AND METHOD FOR FORMING

BOND PAD HAVING A TRENCH AND METHOD FOR FORMING

Semiconductor device and method of formation

Apparatus for connecting a semiconductor die to a substrate and met...

SEMICONDUCTOR DEVICE CONDUCTIVE BUMP AND INTERCONNECT BARRIER