David B. Russell

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Cleveland, OH, US

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Patents Grantslast 30 patents

Information Patent Grant
Process for manufacturing copper foil on a metal carrier substrate
- Patent number 6,770,976
- Issue date Aug 3, 2004
- Nikko Materials USA, Inc.
- Jiangtao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesiveless flexible laminate and process for making adhesiveless...
- Patent number 6,171,714
- Issue date Jan 9, 2001
- Gould Electronics Inc.
- Nicholas E. Bergkessel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Process for manufacturing copper foil on a metal carrier substrate
- Publication number 20030153169
- Publication date Aug 14, 2003
- Gould Electronics Inc.
- Jiangtao Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR