David Blumel

Follow

Person

New York, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer coating method for flip chips
- Patent number 6,323,062
- Issue date Nov 27, 2001
- Alpha Metals, Inc.
- Kenneth Burton Gilleo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip with integrated mask and underfill
- Patent number 6,228,678
- Issue date May 8, 2001
- Fry's Metals, Inc.
- Kenneth Burton Gilleo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip having integral mask and underfill providing two-stage bu...
- Patent number 6,228,681
- Issue date May 8, 2001
- Fry's Metals, Inc.
- Kenneth Burton Gilleo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip with integrated flux and underfill
- Patent number 6,194,788
- Issue date Feb 27, 2001
- Alpha Metals, Inc.
- Kenneth Burton Gilleo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Rosin-free, low VOC, no-clean soldering flux and method using the same
- Patent number 5,571,340
- Issue date Nov 5, 1996
- Fry's Metals, Inc.
- Alvin F. Schneider
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
No-clean soldering flux and method using the same
- Patent number 5,297,721
- Issue date Mar 29, 1994
- Fry's Metals, Inc.
- Alvin F. Schneider
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Flip chip with integrated flux and underfill
- Publication number 20010003058
- Publication date Jun 7, 2001
- Kenneth Burton Gilleo
- H01 - BASIC ELECTRIC ELEMENTS