David Bolognia

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging for fingerprint sensors and methods of manufacture
- Patent number 11,545,405
- Issue date Jan 3, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Patrick Huemoeller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaging for fingerprint sensors and methods of manufacture
- Patent number 10,636,717
- Issue date Apr 28, 2020
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaging for fingerprint sensors and methods of manufacture
- Patent number RE47890
- Issue date Mar 3, 2020
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
Information Patent Grant
Reversible top/bottom MEMS package
- Patent number 9,776,855
- Issue date Oct 3, 2017
- Amkor Technology, Inc.
- David Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging for fingerprint sensors and methods of manufacture
- Patent number 9,754,852
- Issue date Sep 5, 2017
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reversible top/bottom MEMS package
- Patent number 9,359,191
- Issue date Jun 7, 2016
- Amkor Technology, Inc.
- David Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reversible top/bottom MEMS package
- Patent number 8,981,537
- Issue date Mar 17, 2015
- Amkor Technology, Inc.
- David Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fingerprint sensor package and method
- Patent number 8,717,775
- Issue date May 6, 2014
- Amkor Technology, Inc.
- David Bolognia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting diode (LED) package and method
- Patent number 8,535,961
- Issue date Sep 17, 2013
- Amkor Technology, Inc.
- Bob Shih-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reversible top/bottom MEMS package
- Patent number 8,115,283
- Issue date Feb 14, 2012
- Amkor Technology, Inc.
- David Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for compartmental shielding of stacked packages
- Patent number 8,102,032
- Issue date Jan 24, 2012
- Amkor Technology, Inc.
- David Bolognia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reversible top/bottom MEMS package
- Patent number 8,030,722
- Issue date Oct 4, 2011
- Amkor Technology, Inc.
- David Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method to reduce shorting of radio frequency (RF) shielding
- Patent number 8,008,753
- Issue date Aug 30, 2011
- Amkor Technology, Inc.
- David Bolognia
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE
- Publication number 20200365480
- Publication date Nov 19, 2020
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE
- Publication number 20180090409
- Publication date Mar 29, 2018
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Reversible Top/Bottom MEMS Package
- Publication number 20160355395
- Publication date Dec 8, 2016
- Amkor Technology, Inc.
- David Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REVERSIBLE TOP/BOTTOM MEMS PACKAGE
- Publication number 20150191346
- Publication date Jul 9, 2015
- Amkor Technology, Inc.
- David Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REVERSIBLE TOP/BOTTOM MEMS PACKAGE
- Publication number 20120104629
- Publication date May 3, 2012
- David Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY

David Bolognia

Person

Patents Grantslast 30 patents

Packaging for fingerprint sensors and methods of manufacture

Packaging for fingerprint sensors and methods of manufacture

Packaging for fingerprint sensors and methods of manufacture

Reversible top/bottom MEMS package

Packaging for fingerprint sensors and methods of manufacture

Reversible top/bottom MEMS package

Reversible top/bottom MEMS package

Fingerprint sensor package and method

Light emitting diode (LED) package and method

Reversible top/bottom MEMS package

System and method for compartmental shielding of stacked packages

Reversible top/bottom MEMS package

System and method to reduce shorting of radio frequency (RF) shielding

Patents Applicationslast 30 patents

PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE

PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE

Reversible Top/Bottom MEMS Package

REVERSIBLE TOP/BOTTOM MEMS PACKAGE

REVERSIBLE TOP/BOTTOM MEMS PACKAGE