David C. Grant Jr.

Person

Thousand Oaks, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer shape thickness and trench measurement
- Patent number 9,714,825
- Issue date Jul 25, 2017
- Rudolph Technologies, Inc.
- David S. Marx
- G01 - MEASURING TESTING
Information Patent Grant
System for directly measuring the depth of a high aspect ratio etch...
- Patent number 9,587,932
- Issue date Mar 7, 2017
- Rudolph Technologies, Inc.
- David S. Marx
- G01 - MEASURING TESTING
Information Patent Grant
System for directly measuring the depth of a high aspect ratio etch...
- Patent number 8,649,016
- Issue date Feb 11, 2014
- Rudolph Technologies, Inc.
- David S. Marx
- G01 - MEASURING TESTING
Information Patent Grant
Wafer measurement system and apparatus
- Patent number 7,738,113
- Issue date Jun 15, 2010
- Tamar Technology, Inc.
- David S. Marx
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench measurement system employing a chromatic confocal height sen...
- Patent number 7,477,401
- Issue date Jan 13, 2009
- Tamar Technology, Inc.
- David S. Marx
- G01 - MEASURING TESTING
Information Patent Grant
Concentricity measuring instrument for a fiberoptic cable end
- Patent number 6,710,864
- Issue date Mar 23, 2004
- David L. Grant
- G01 - MEASURING TESTING
Information Patent Grant
Optical combiner for a ring laser gyro
- Patent number 4,863,271
- Issue date Sep 5, 1989
- Litton Systems, Inc.
- David C. Grant
- G01 - MEASURING TESTING
Information Patent Grant
Controllable mirrors
- Patent number 4,383,763
- Issue date May 17, 1983
- Litton Systems, Inc.
- Thomas J. Hutchings
- G02 - OPTICS
Information Patent Grant
Ring laser
- Patent number 4,317,089
- Issue date Feb 23, 1982
- Litton Systems, Inc.
- David C. Grant
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM FOR DIRECTLY MEASURING THE DEPTH OF A HIGH ASPECT RATIO ETCH...
- Publication number 20160238378
- Publication date Aug 18, 2016
- Rudolph Technologies, Inc.
- David S. Marx
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF CHARACTERIZING MICROFABRICATION PROCESS AND PRODUCTS THEREOF
- Publication number 20150362314
- Publication date Dec 17, 2015
- RUDOLPH TECHNOLOGIES, INC.
- Rajiv Roy
- G01 - MEASURING TESTING
Information Patent Application
SYSTEM FOR DIRECTLY MEASURING THE DEPTH OF A HIGH ASPECT RATIO ETCH...
- Publication number 20140110582
- Publication date Apr 24, 2014
- Rudolph Technologies, Inc.
- David S. Marx
- G01 - MEASURING TESTING
Information Patent Application
Wafer shape thickness and trench measurement
- Publication number 20120257207
- Publication date Oct 11, 2012
- David S. Marx
- G01 - MEASURING TESTING
Information Patent Application
System for directly measuring the depth of a high aspect ratio etch...
- Publication number 20110292375
- Publication date Dec 1, 2011
- David S. Marx
- G01 - MEASURING TESTING
Information Patent Application
System for directly measuring the depth of a high aspect ratio etch...
- Publication number 20100321671
- Publication date Dec 23, 2010
- David S. Marx
- G01 - MEASURING TESTING
Information Patent Application
Wafer measurement system and apparatus
- Publication number 20070148792
- Publication date Jun 28, 2007
- David S. Marx
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trench measurement system employing a chromatic confocal height sen...
- Publication number 20060109483
- Publication date May 25, 2006
- Tamar Technology, Inc.
- David S. Marx
- G02 - OPTICS

David C. Grant Jr.

Person

Patents Grantslast 30 patents

Wafer shape thickness and trench measurement

System for directly measuring the depth of a high aspect ratio etch...

System for directly measuring the depth of a high aspect ratio etch...

Wafer measurement system and apparatus

Trench measurement system employing a chromatic confocal height sen...

Concentricity measuring instrument for a fiberoptic cable end

Optical combiner for a ring laser gyro

Controllable mirrors

Ring laser

Patents Applicationslast 30 patents

SYSTEM FOR DIRECTLY MEASURING THE DEPTH OF A HIGH ASPECT RATIO ETCH...

METHOD OF CHARACTERIZING MICROFABRICATION PROCESS AND PRODUCTS THEREOF

SYSTEM FOR DIRECTLY MEASURING THE DEPTH OF A HIGH ASPECT RATIO ETCH...

Wafer shape thickness and trench measurement

System for directly measuring the depth of a high aspect ratio etch...

System for directly measuring the depth of a high aspect ratio etch...

Wafer measurement system and apparatus

Trench measurement system employing a chromatic confocal height sen...